Footprints

61 footprints matching “56”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

61 footprints · page 1 of 3

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QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 381

SOT-563

FP3D

Package_TO_SOT_SMD

SOT, 6 Pin (https://www.jedec.org/system/files/docs/MO-293B.pdf)

Pads: 6
SMD: 2.4×1.9
Boards: 160

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)

Pads: 57
SMD: 8.3×8.3
Boards: 34

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads: 44
SMD: 13.3×13.3
Boards: 27

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads: 57
SMD: 8.2×8.2
Boards: 24

BGA-256_14.0x14.0mm_Layout16x16_P0.8mm_Ball0.45mm_Pad0.32mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads: 256
SMD: 16.0×16.0
Boards: 23

LFPAK56

FP3D

Package_TO_SOT_SMD

LFPAK56 https://assets.nexperia.com/documents/outline-drawing/SOT669.pdf

Pads: 5
SMD: 7.3×5.5
Boards: 22

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 21

HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm

FP3D

Package_SO

HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf

Pads: 57
SMD: 9.6×14.6
Boards: 16

C_2225_5664Metric_Pad1.80x6.60mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads: 2
SMD: 7.6×7.1
Boards: 10

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

BGA-256_17.0x17.0mm_Layout16x16_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads: 256
SMD: 19.0×19.0
Boards: 5

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads: 57
SMD: 8.2×8.2
Boards: 5

SSOP-56_7.5x18.5mm_P0.635mm

FP3D

Package_SO

SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)

Pads: 56
SMD: 11.1×19.1
Boards: 5

C_2225_5664Metric

FP3D

Capacitor_SMD

Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads: 2
SMD: 7.2×7.1
Boards: 3

Mounting_Wuerth_WA-SMSI-M1.6_H2.5mm_ThreadDepth1.5mm_NoNPTH_97730256330

FP3D

Mounting_Wuerth

Mounting Hardware, inside blind hole M1.6, height 2.5, Wuerth electronics 97730256330 (https://www.we-online.com/components/products/datasheet/97730256330R.pdf)

Pads: 1
SMD: 4.5×4.5
Boards: 3

TSOP-I-56_18.4x14mm_P0.5mm

FP3D

Package_SO

TSOP-I, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EC)

Pads: 56
SMD: 21.5×14.5
Boards: 3

C_1825_4564Metric

FP3D

Capacitor_SMD

Capacitor SMD 1825 (4564 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)

Pads: 2
SMD: 6.0×7.3
Boards: 2

Molex_SlimStack_55560-0301_2x15_P0.50mm_Vertical

FP3D

Connector_Molex

Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0301, 30 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf)

Pads: 30
SMD: 10.0×5.9
Boards: 2

QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.ti.com/lit/an/scea032/scea032.pdf#page=4)

Pads: 57
SMD: 9.3×9.3
Boards: 2

TSSOP-56_6.1x14mm_P0.5mm

FP3D

Package_SO

TSSOP, 56 Pin (JEDEC MO-153 Var EE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 56
SMD: 9.4×14.5
Boards: 2

C_1825_4564Metric_Pad1.57x6.80mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 1825 (4564 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size from: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)

Pads: 2
SMD: 6.4×7.3
Boards: 1

Molex_SlimStack_55560-0161_2x08_P0.50mm_Vertical

FP3D

Connector_Molex

Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0161, 16 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf)

Pads: 16
SMD: 6.5×5.9
Boards: 1