Footprints
18 footprints matching “6.5mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TSSOP-20_4.4x6.5mm_P0.65mm
Package_SO
TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 20
- SMD
- 7.7×7.0
- Boards
- 731
SSOP-20_4.4x6.5mm_P0.65mm
Package_SO
SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)
- Pads
- 20
- SMD
- 7.8×7.0
- Boards
- 39
ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 7
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- 6
LQFP-64-1EP_10x10mm_P0.5mm_EP6.5x6.5mm
Package_QFP
LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/98ARH98426A.pdf)
- Pads
- 65
- SMD
- 13.3×13.3
- Boards
- 3
SSOP-18_4.4x6.5mm_P0.65mm
Package_SO
SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)
- Pads
- 18
- SMD
- 6.9×7.0
- Boards
- 3
QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm
Package_DFN_QFN
QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)
- Pads
- 65
- SMD
- 9.2×9.2
- Boards
- 2
QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm_ThermalVias
Package_DFN_QFN
QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)
- Pads
- 65
- SMD
- 9.2×9.2
- Boards
- 1
LQFP-64-1EP_10x10mm_P0.5mm_EP6.5x6.5mm_ThermalVias
Package_QFP
LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/98ARH98426A.pdf)
- Pads
- 65
- SMD
- 13.3×13.3
- Boards
- 1
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_ThermalVias
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 1
Mounting_Wuerth_WA-SMSI-M2.5_H6.5mm_9774065151
Mounting_Wuerth
Mounting Hardware, inside through hole M2.5, height 6.5, Wuerth electronics 9774065151 (https://www.we-online.com/components/products/datasheet/9774065151R.pdf)
- Pads
- 1
- SMD
- 6.5×6.5
- Boards
- —
Mounting_Wuerth_WA-SMST-2.7mm_H6.5mm_9774065951
Mounting_Wuerth
Mounting Hardware, inside through hole 2.7mm, height 6.5, Wuerth electronics 9774065951 (https://www.we-online.com/components/products/datasheet/9774065951R.pdf)
- Pads
- 1
- SMD
- 6.5×6.5
- Boards
- —
TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm
Package_QFP
TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm_ThermalVias
Package_QFP
TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
TSSOP-24_4.4x6.5mm_P0.5mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 Var BB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×7.0
- Boards
- —
TSSOP-32_4.4x6.5mm_P0.4mm
Package_SO
TSSOP, 32 Pin (JEDEC MO-153 Var CB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 32
- SMD
- 7.7×7.0
- Boards
- —