Footprints
23 footprints matching “CASE”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LQFP-48_7x7mm_P0.5mm
Package_QFP
LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)
- Pads
- 48
- SMD
- 10.3×10.3
- Boards
- 862
SOIC-8_5.3x5.3mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)
- Pads
- 8
- SMD
- 9.3×5.8
- Boards
- 139
TQFP-100_14x14mm_P0.5mm
Package_QFP
TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)
- Pads
- 100
- SMD
- 17.3×17.3
- Boards
- 93
LQFP-44_10x10mm_P0.8mm
Package_QFP
LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 27
DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm
Package_DFN_QFN
DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)
- Pads
- 9
- SMD
- 2.8×2.5
- Boards
- 20
DFN-6-1EP_3x3mm_P0.95mm_EP1.7x2.6mm
Package_DFN_QFN
DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)
- Pads
- 7
- SMD
- 3.8×3.7
- Boards
- 10
OnSemi_CASE100CY
OptoDevice
OnSemi CASE 100CY, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF
- Pads
- 4
- SMD
- 3.7×6.2
- Boards
- 9
TQFP-128_14x14mm_P0.4mm
Package_QFP
TQFP, 128 Pin (JEDEC MS-026 variation AEE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 4
PQFP-80_14x20mm_P0.8mm
Package_QFP
PQFP, 80 Pin (JEITA/EIAJ ED-7311A (variation 80-001-PB) / JEDEC MS-022 (variation GB-2), 2.70mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=91, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)
- Pads
- 80
- SMD
- 18.5×24.5
- Boards
- 3
Mini-Circuits_FG873-4_3x3mm
Package_DFN_QFN
Mini Circuits Case style FG (https://ww2.minicircuits.com/case_style/FG873.pdf)
- Pads
- 4
- SMD
- 5.2×5.2
- Boards
- 1
TQFP-64_7x7mm_P0.4mm
Package_QFP
TQFP, 64 Pin (JEDEC MS-026 variation ABD, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfpsu/su_64_1.pdf)
- Pads
- 64
- SMD
- 10.3×10.3
- Boards
- 1
TQFP-128_14x14mm_P0.4mm_PAD
muratovas-MAS_Package_std
TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 932BB.PDF)
- Pads
- 129
- SMD
- 16.9×16.9
- Boards
- —
NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm
Package_BGA
NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf
- Pads
- 98
- SMD
- 9.0×9.0
- Boards
- —
NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm
Package_BGA
NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf
- Pads
- 59
- SMD
- 6.0×6.0
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
DFN-12-1EP_4x4mm_P0.65mm_EP2.64x3.54mm
Package_DFN_QFN
DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CE.PDF)
- Pads
- 13
- SMD
- 4.8×4.7
- Boards
- —
DFN-20-1EP_5x6mm_P0.5mm_EP3.24x4.24mm
Package_DFN_QFN
DFN20, 6x5, 0.5P; CASE 505AB (see ON Semiconductor 505AB.PDF)
- Pads
- 21
- SMD
- 5.8×6.7
- Boards
- —
DFN-22-1EP_5x6mm_P0.5mm_EP3.14x4.3mm
Package_DFN_QFN
DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF-01 (https://www.onsemi.com/download/package-drawing/pdf/506af.pdf)
- Pads
- 23
- SMD
- 6.3×6.7
- Boards
- —
DFN-44-1EP_5x8.9mm_P0.4mm_EP3.7x8.4mm
Package_DFN_QFN
DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506BU.PDF)
- Pads
- 45
- SMD
- 5.8×9.6
- Boards
- —
LQFP-176_20x20mm_P0.4mm
Package_QFP
LQFP, 176 Pin (JEDEC MS-026 variation BFC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 176
- SMD
- 23.3×23.3
- Boards
- —
PQFP-256_28x28mm_P0.4mm
Package_QFP
PQFP256 28x28 / QFP256J CASE 122BX (see ON Semiconductor 122BX.PDF)
- Pads
- 256
- SMD
- 31.5×31.5
- Boards
- —
TQFP-120_14x14mm_P0.4mm
Package_QFP
TQFP120 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 932AZ.PDF)
- Pads
- 120
- SMD
- 16.9×16.9
- Boards
- —