NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

Package_BGA

NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf

Footprint

59 pads

Footprint NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

Mount: Surface mount
Courtyard: 6 × 6 mm
Pads: 59
File: 10 KB

3D model

STEP

Package_BGA_NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

4 × 4 × 0.87 mm

66 KB STEP

Library: Package_BGA_NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9
Model page: Open →

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception