Footprints
3 footprints matching “Universal”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
D_SMA-SMB_Universal_Handsoldering
Diode_SMD
Diode, Universal, SMA (DO-214AC) or SMB (DO-214AA), Handsoldering,
- Pads
- 2
- SMD
- 9.9×4.5
- Boards
- 40
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
D_SMB-SMC_Universal_Handsoldering
Diode_SMD
Diode, Universal, SMB(DO-214AA) or SMC (DO-214AB), Handsoldering,
- Pads
- 2
- SMD
- 11.2×6.7
- Boards
- 8