Footprints
36 footprints matching “flat”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 55
Diodes_PowerDI3333-8
Package_SON
Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf
- Pads
- 5
- SMD
- 4.2×3.8
- Boards
- 33
L_Murata_DFE201610P
Inductor_SMD
Inductor, Murata, DFE201610P, 2.0x1.6x1.0mm, (https://www.murata.com/~/media/webrenewal/products/inductor/chip/tokoproducts/wirewoundmetalalloychiptype/m_dfe201610p.ashx)
- Pads
- 2
- SMD
- 2.5×2.1
- Boards
- 32
DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_DFN_QFN
6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 32
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
VSON-8_3.3x3.3mm_P0.65mm_NexFET
Package_SON
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf
- Pads
- 5
- SMD
- 4.0×3.8
- Boards
- 16
DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 11
- SMD
- 4.3×3.7
- Boards
- 11
L_Wuerth_HCI-1040
Inductor_SMD
Inductor, Wuerth, HCI-1040, 10.2x10.2x4.0mm, (https://www.we-online.com/components/products/datasheet/744355215.pdf)
- Pads
- 2
- SMD
- 12.0×10.7
- Boards
- 9
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
LQFP-128_14x14mm_P0.4mm
Package_QFP
LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 9
L_Wuerth_HCI-1365
Inductor_SMD
Inductor, Wuerth, HCI-1365, 12.8x12.8x6.2mm, (https://www.we-online.com/components/products/datasheet/744355122.pdf)
- Pads
- 2
- SMD
- 15.5×13.3
- Boards
- 8
L_Wuerth_HCI-5040
Inductor_SMD
Inductor, Wuerth, HCI-5040, 5.5x5.3x4.0mm, (https://www.we-online.com/components/products/datasheet/744316022.pdf)
- Pads
- 2
- SMD
- 6.5×5.8
- Boards
- 5
L_Wuerth_HCI-1350
Inductor_SMD
Inductor, Wuerth, HCI-1350, 12.8x12.8x4.7mm, (https://www.we-online.com/components/products/datasheet/744355019.pdf)
- Pads
- 2
- SMD
- 15.5×13.3
- Boards
- 4
Diode_Bridge_Vishay_DFSFlat
Diode_SMD
SMD diode bridge Low Profile DFS "Flat", see http://www.vishay.com/docs/88874/dfl15005.pdf
- Pads
- 4
- SMD
- 11.2×8.9
- Boards
- 3
DFN-S-8-1EP_6x5mm_P1.27mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 7.2×5.7
- Boards
- 3
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
L_Wuerth_HCI-7030
Inductor_SMD
Inductor, Wuerth, HCI-7030, 6.9x6.9x3.0mm, (https://www.we-online.com/components/products/datasheet/744310013.pdf)
- Pads
- 2
- SMD
- 8.3×7.4
- Boards
- 2
L_Wuerth_HCI-7040
Inductor_SMD
Inductor, Wuerth, HCI-7040, 6.9x6.9x3.8mm, (https://www.we-online.com/components/products/datasheet/744311022.pdf)
- Pads
- 2
- SMD
- 8.3×7.4
- Boards
- 2
QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm
Package_DFN_QFN
64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- 2
UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm
Package_DFN_QFN
16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 2
WSON-14-1EP_4.0x4.0mm_P0.5mm_EP2.6x2.6mm
Package_SON
14-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf
- Pads
- 15
- SMD
- 4.9×4.5
- Boards
- 2
L_Wuerth_HCI-1030
Inductor_SMD
Inductor, Wuerth, HCI-1030, 10.6x10.6x2.8mm, (https://www.we-online.com/components/products/datasheet/744323020.pdf)
- Pads
- 2
- SMD
- 12.0×11.1
- Boards
- 1