Footprints

210 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

210 footprints · page 1 of 9

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TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads: 8
SMD: 5.9×3.6
Boards: 111

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads: 144
SMD: 23.3×23.3
Boards: 104

SW_Tactile_SPST_NO_Straight_CK_PTS636Sx25SMTRLFS

FP3D

Button_Switch_SMD

Tactile switch, SPST, 6.0x3.5 mm, H2.5 mm, straight, NO, gull wing leads: https://www.ckswitches.com/media/2779/pts636.pdf

Pads: 2
SMD: 9.5×4.2
Boards: 90

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 87

SMDIP-4_W9.53mm

FP3D

Package_DIP

4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 4
SMD: 12.0×5.6
Boards: 57

DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 55

TSOP-II-54_22.2x10.16mm_P0.8mm

FP3D

Package_SO

54-lead TSOP typ II package

Pads: 54
SMD: 13.5×22.7
Boards: 55

SSOP-20_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)

Pads: 20
SMD: 6.9×9.3
Boards: 54

SW_Push_1P1T_NO_CK_KSC6xxJ

FP3D

Button_Switch_SMD

Tactile switch, 6.2x6.25 mm, H7.68 mm, J leads, https://www.ckswitches.com/media/1972/ksc6.pdf

Pads: 2
SMD: 9.1×6.8
Boards: 50

SO-4_4.4x3.6mm_P2.54mm

FP3D

Package_SO

4-Lead Plastic Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339

Pads: 4
SMD: 8.8×4.1
Boards: 49

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 47

SSOP-28_3.9x9.9mm_P0.635mm

FP3D

Package_SO

SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)

Pads: 28
SMD: 6.9×10.4
Boards: 33

TI_SO-PowerPAD-8

FP3D

Package_SO

8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)

Pads: 9
SMD: 8.0×5.4
Boards: 33

Diodes_PowerDI3333-8

FP3D

Package_SON

Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf

Pads: 5
SMD: 4.2×3.8
Boards: 33