Footprints

10,277 footprints

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

10,277 footprints · page 13 of 429

JST_SH_SM06B-SRSS-TB_1x06-1MP_P1.00mm_Horizontal

FP3D

Connector_JST

JST SH series connector, SM06B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf)

Pads
7
SMD
9.8×6.6
Boards
62

NetTie-2_SMD_Pad2.0mm

FP—

NetTie

Net tie, 2 pin, 2.0mm square SMD pads

Pads
2
SMD
smd
Boards
62

CP_EIA-3528-15_AVX-H

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD AVX-H (3528-15 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads
2
SMD
4.9×3.3
Boards
61

LED_RGB_5050-6

FP3D

LED_SMD

http://cdn.sparkfun.com/datasheets/Components/LED/5060BRG4.pdf

Pads
6
SMD
7.3×5.5
Boards
61

LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y

FP3D

Package_LGA

LGA, 16 Pin (https://www.st.com/resource/en/datasheet/lis331dlh.pdf)

Pads
16
SMD
3.5×3.5
Boards
61

C_0201_0603Metric_Pad0.64x0.40mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf)

Pads
2
SMD
1.8×0.7
Boards
60

Bosch_LGA-14_3x2.5mm_P0.5mm

FP3D

Package_LGA

LGA-14 Bosch https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMI160-DS000-07.pdf

Pads
14
SMD
3.7×3.2
Boards
60

WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias

FP3D

Package_SON

WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)

Pads
7
SMD
2.7×2.5
Boards
60

C_Elec_6.3x7.7

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic nonpolar, 6.3x7.7mm

Pads
2
SMD
8.9×7.1
Boards
59

L_Bourns_SRP7028A_7.3x6.6mm

FP—

Inductor_SMD

Shielded Power Inductors (https://www.bourns.com/docs/product-datasheets/srp7028a.pdf)

Pads
2
SMD
8.9×7.1
Boards
59

CP_EIA-3528-12_Kemet-T

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD Kemet-T (3528-12 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads
2
SMD
4.9×3.3
Boards
58

microSD_HC_Wuerth_693072010801

FP—

Connector_Card

http://katalog.we-online.de/em/datasheet/693072010801.pdf

Pads
9
SMD
16.2×14.7
Boards
58

SMA_Molex_73251-1153_EdgeMount_Horizontal

FP3D

Connector_Coaxial

Molex SMA RF Connectors, Edge Mount, https://tools.molex.com/pdm_docs/sd/732511150_sd.pdf

Pads
2
SMD
17.0×12.2
Boards
58

JST_SH_SM03B-SRSS-TB_1x03-1MP_P1.00mm_Horizontal

FP3D

Connector_JST

JST SH series connector, SM03B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf)

Pads
4
SMD
6.8×6.6
Boards
58

TQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads
64
SMD
13.3×13.3
Boards
58

SMDIP-4_W9.53mm

FP3D

Package_DIP

4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads
4
SMD
12.0×5.6
Boards
57

SOIC-16W_5.3x10.2mm_P1.27mm

FP3D

Package_SO

SOIC, 16 Pin (http://www.ti.com/lit/ml/msop002a/msop002a.pdf)

Pads
16
SMD
9.4×10.7
Boards
57

SSOP-8_2.95x2.8mm_P0.65mm

FP3D

Package_SO

SSOP-8 2.9 x2.8mm Pitch 0.65mm

Pads
8
SMD
5.5×3.3
Boards
57

TSOT-23_HandSoldering

FP3D

Package_TO_SOT_SMD

5-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_5_05-08-1635.pdf

Pads
3
SMD
5.9×3.4
Boards
57

BatteryHolder_Keystone_1060_1x2032

FP3D

Battery

http://www.keyelco.com/product-pdf.cfm?p=726

Pads
2
SMD
32.9×21.4
Boards
56

Crystal_SMD_SeikoEpson_FA238-4Pin_3.2x2.5mm

FP3D

Crystal

Epson Toyocom FA-238, crystal, 3.2x2.5mm package, SMD, http://www.mouser.com/ds/2/137/1721499-465440.pdf

Pads
4
SMD
4.2×3.5
Boards
56

LGA-28_5.2x3.8mm_P0.5mm

FP3D

Package_LGA

LGA 28 5.2x3.8mm Pitch 0.5mm

Pads
28
SMD
6.0×4.5
Boards
56

DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
9
SMD
4.3×3.5
Boards
55

LGA-8_3x5mm_P1.25mm

FP3D

Package_LGA

LGA-8

Pads
8
SMD
3.6×5.5
Boards
55