Footprints
10,277 footprints
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
JST_SH_SM06B-SRSS-TB_1x06-1MP_P1.00mm_Horizontal
Connector_JST
JST SH series connector, SM06B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf)
- Pads
- 7
- SMD
- 9.8×6.6
- Boards
- 62
NetTie-2_SMD_Pad2.0mm
NetTie
Net tie, 2 pin, 2.0mm square SMD pads
- Pads
- 2
- SMD
- smd
- Boards
- 62
CP_EIA-3528-15_AVX-H
Capacitor_Tantalum_SMD
Tantalum Capacitor SMD AVX-H (3528-15 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)
- Pads
- 2
- SMD
- 4.9×3.3
- Boards
- 61
LED_RGB_5050-6
LED_SMD
http://cdn.sparkfun.com/datasheets/Components/LED/5060BRG4.pdf
- Pads
- 6
- SMD
- 7.3×5.5
- Boards
- 61
LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y
Package_LGA
LGA, 16 Pin (https://www.st.com/resource/en/datasheet/lis331dlh.pdf)
- Pads
- 16
- SMD
- 3.5×3.5
- Boards
- 61
C_0201_0603Metric_Pad0.64x0.40mm_HandSolder
Capacitor_SMD
Capacitor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf)
- Pads
- 2
- SMD
- 1.8×0.7
- Boards
- 60
Bosch_LGA-14_3x2.5mm_P0.5mm
Package_LGA
LGA-14 Bosch https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMI160-DS000-07.pdf
- Pads
- 14
- SMD
- 3.7×3.2
- Boards
- 60
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 60
C_Elec_6.3x7.7
Capacitor_SMD
SMD capacitor, aluminum electrolytic nonpolar, 6.3x7.7mm
- Pads
- 2
- SMD
- 8.9×7.1
- Boards
- 59
L_Bourns_SRP7028A_7.3x6.6mm
Inductor_SMD
Shielded Power Inductors (https://www.bourns.com/docs/product-datasheets/srp7028a.pdf)
- Pads
- 2
- SMD
- 8.9×7.1
- Boards
- 59
CP_EIA-3528-12_Kemet-T
Capacitor_Tantalum_SMD
Tantalum Capacitor SMD Kemet-T (3528-12 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)
- Pads
- 2
- SMD
- 4.9×3.3
- Boards
- 58
microSD_HC_Wuerth_693072010801
Connector_Card
http://katalog.we-online.de/em/datasheet/693072010801.pdf
- Pads
- 9
- SMD
- 16.2×14.7
- Boards
- 58
SMA_Molex_73251-1153_EdgeMount_Horizontal
Connector_Coaxial
Molex SMA RF Connectors, Edge Mount, https://tools.molex.com/pdm_docs/sd/732511150_sd.pdf
- Pads
- 2
- SMD
- 17.0×12.2
- Boards
- 58
JST_SH_SM03B-SRSS-TB_1x03-1MP_P1.00mm_Horizontal
Connector_JST
JST SH series connector, SM03B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf)
- Pads
- 4
- SMD
- 6.8×6.6
- Boards
- 58
TQFP-64_10x10mm_P0.5mm
Package_QFP
TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 64
- SMD
- 13.3×13.3
- Boards
- 58
SMDIP-4_W9.53mm
Package_DIP
4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 4
- SMD
- 12.0×5.6
- Boards
- 57
SOIC-16W_5.3x10.2mm_P1.27mm
Package_SO
SOIC, 16 Pin (http://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 16
- SMD
- 9.4×10.7
- Boards
- 57
SSOP-8_2.95x2.8mm_P0.65mm
Package_SO
SSOP-8 2.9 x2.8mm Pitch 0.65mm
- Pads
- 8
- SMD
- 5.5×3.3
- Boards
- 57
TSOT-23_HandSoldering
Package_TO_SOT_SMD
5-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_5_05-08-1635.pdf
- Pads
- 3
- SMD
- 5.9×3.4
- Boards
- 57
BatteryHolder_Keystone_1060_1x2032
Battery
http://www.keyelco.com/product-pdf.cfm?p=726
- Pads
- 2
- SMD
- 32.9×21.4
- Boards
- 56
Crystal_SMD_SeikoEpson_FA238-4Pin_3.2x2.5mm
Crystal
Epson Toyocom FA-238, crystal, 3.2x2.5mm package, SMD, http://www.mouser.com/ds/2/137/1721499-465440.pdf
- Pads
- 4
- SMD
- 4.2×3.5
- Boards
- 56
LGA-28_5.2x3.8mm_P0.5mm
Package_LGA
LGA 28 5.2x3.8mm Pitch 0.5mm
- Pads
- 28
- SMD
- 6.0×4.5
- Boards
- 56
DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 55
LGA-8_3x5mm_P1.25mm
Package_LGA
LGA-8
- Pads
- 8
- SMD
- 3.6×5.5
- Boards
- 55
