Footprints

1,025 footprints matching “0.5mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,025 footprints · page 1 of 43

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LQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)

Pads: 48
SMD: 10.3×10.3
Boards: 862

LQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf)

Pads: 64
SMD: 13.4×13.4
Boards: 663

MSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)

Pads: 10
SMD: 6.2×3.5
Boards: 333

NetTie-2_SMD_Pad0.5mm

FP—

NetTie

Net tie, 2 pin, 0.5mm square SMD pads

Pads: 2
SMD: smd
Boards: 309

LQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

LQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf)

Pads: 100
SMD: 17.5×17.5
Boards: 273

QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)

Pads: 25
SMD: 5.2×5.2
Boards: 256

QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm

FP—

Package_DFN_QFN

QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)

Pads: 49
SMD: 8.3×8.3
Boards: 245

QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 176

QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)

Pads: 29
SMD: 6.2×6.2
Boards: 175

Fiducial_0.5mm_Mask1mm

FP—

Fiducial

Fiducial, circular marking, 0.5mm bare copper, 1mm soldermask opening (Level C)

Pads: —
SMD: 1.5×1.5
Boards: 161

VSSOP-8_2.3x2mm_P0.5mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads: 8
SMD: 4.6×2.5
Boards: 156

TSSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)

Pads: 10
SMD: 6.3×3.5
Boards: 153

InvenSense_QFN-24_4x4mm_P0.5mm

FP—

Sensor_Motion

24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 5.3×5.3
Boards: 136

LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y

FP3D

Package_LGA

LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf)

Pads: 14
SMD: 3.5×3.0
Boards: 118

QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)

Pads: 21
SMD: 5.2×5.2
Boards: 115

LGA-12_2x2mm_P0.5mm

FP3D

Package_LGA

LGA12

Pads: 12
SMD: 2.5×2.5
Boards: 115

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads: 144
SMD: 23.3×23.3
Boards: 104

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads: 100
SMD: 17.3×17.3
Boards: 93

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 87

QFN-44-1EP_7x7mm_P0.5mm_EP5.2x5.2mm

FP—

Package_DFN_QFN

QFN, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17)

Pads: 45
SMD: 8.3×8.3
Boards: 85

TQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=666)

Pads: 48
SMD: 10.3×10.3
Boards: 85