Footprints
23 footprints matching “17mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
Lattice_caBGA-381_17x17mm_Layout20x20_P0.8mm
Package_BGA
Lattice caBGA-381, ECP5 FPGAs, 17.0x17.0mm, 381 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213
- Pads
- 381
- SMD
- 19.0×19.0
- Boards
- 1
CAP ALSMD ELEC 13.6MM H17MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 13.60mm Land Size, 12.50mm Diameter, 17.00mm Height, 14.60mm Maximum Leads Span
- Pads
- 2
- SMD
- 18.4×14.0
- Boards
- —
CAP ALSMD ELEC 13MM H17MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 13.00mm Land Size, 12.50mm Diameter, 17.00mm Height, 13.70mm Maximum Leads Span
- Pads
- 2
- SMD
- 17.4×13.4
- Boards
- —
CAP ALSMD ELEC 17.1MM H17MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 17.10mm Land Size, 16.00mm Diameter, 17.00mm Height, 18.30mm Maximum Leads Span
- Pads
- 2
- SMD
- 23.0×17.5
- Boards
- —
CAP ALSMD ELEC 17MM H16.5MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 17.00mm Land Size, 16.00mm Diameter, 16.50mm Height, 19.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 23.6×17.4
- Boards
- —
CAP ALSMD ELEC 17MM H16.8MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 17.00mm Land Size, 16.00mm Diameter, 16.80mm Height, 19.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 23.6×17.4
- Boards
- —
CAP ALSMD ELEC 17MM H17.1MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 17.00mm Land Size, 16.00mm Diameter, 17.10mm Height, 19.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 23.6×17.4
- Boards
- —
CAP ALSMD ELEC 17MM H17MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 17.00mm Land Size, 16.00mm Diameter, 17.00mm Height, 19.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 23.6×17.4
- Boards
- —
CAP ALSMD ELEC 17MM H19MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 17.00mm Land Size, 16.00mm Diameter, 19.00mm Height, 19.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 23.6×17.4
- Boards
- —
CAP ALSMD ELEC 17MM H21.5MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 17.00mm Land Size, 16.00mm Diameter, 21.50mm Height, 19.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 23.6×17.4
- Boards
- —
CAP ALSMD ELEC 17MM H22MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 17.00mm Land Size, 16.00mm Diameter, 22.00mm Height, 19.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 23.6×17.4
- Boards
- —
CAP ALSMD ELEC 19.1MM H17MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 19.10mm Land Size, 18.00mm Diameter, 17.00mm Height, 20.10mm Maximum Leads Span
- Pads
- 2
- SMD
- 25.2×19.5
- Boards
- —
CAP ALSMD ELEC 19MM H17MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 19.00mm Land Size, 18.00mm Diameter, 17.00mm Height, 21.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 26.2×19.4
- Boards
- —
CAP ALSMD ELEC 19MM H17MM CAPD16MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 19.00mm Land Size, 16.00mm Diameter, 17.00mm Height, 21.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 26.2×19.4
- Boards
- —
Infineon_LFBGA-292_17x17mm_Layout20x20_P0.8mm
Package_BGA
Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/
- Pads
- 292
- SMD
- 19.0×19.0
- Boards
- —
Lattice_caBGA-381_17x17mm_Layout20x20_P0.8mm_SMD
Package_BGA
Lattice caBGA-381, ECP5 FPGAs, 17.0x17.0mm, 381 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213
- Pads
- 381
- SMD
- 19.0×19.0
- Boards
- —
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
WLCSP-16_2.225x2.17mm_Layout4x4_P0.5mm
Package_CSP
WLCSP-16 2.225x2.17mm, 2.225x2.17mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf
- Pads
- 16
- SMD
- 4.2×4.2
- Boards
- —
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
PSOP-44_16.9x27.17mm_P1.27mm
Package_SO
PSOP44: plastic thin shrink small outline package; 44 leads; body width 16.90 mm
- Pads
- 44
- SMD
- 19.2×28.8
- Boards
- —
TSSOP-64_6.1x17mm_P0.5mm
Package_SO
TSSOP, 64 Pin (JEDEC MO-153 Var EF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 64
- SMD
- 9.4×17.5
- Boards
- —
TSSOP-80_6.1x17mm_P0.4mm
Package_SO
TSSOP, 80 Pin (JEDEC MO-153 Var FF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 80
- SMD
- 9.4×17.5
- Boards
- —