Footprints
500 footprints matching “24”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 256
TSSOP-24_4.4x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×8.3
- Boards
- 242
SOIC-24W_7.5x15.4mm_P1.27mm
Package_SO
SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)
- Pads
- 24
- SMD
- 11.9×15.9
- Boards
- 141
InvenSense_QFN-24_4x4mm_P0.5mm
Sensor_Motion
24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 5.3×5.3
- Boards
- 136
SSOP-24_5.3x8.2mm_P0.65mm
Package_SO
SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)
- Pads
- 24
- SMD
- 9.4×8.7
- Boards
- 111
USB_Mini-B_Lumberg_2486_01_Horizontal
Connector_USB
USB Mini-B 5-pin SMD connector, http://downloads.lumberg.com/datenblaetter/en/2486_01.pdf
- Pads
- 6
- SMD
- 11.9×10.6
- Boards
- 96
InvenSense_QFN-24_3x3mm_P0.4mm
Sensor_Motion
24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 4.1×4.1
- Boards
- 74
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 41
Hirose_FH12-24S-0.5SH_1x24-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-24S-0.5SH, 24 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 25
- SMD
- 18.1×7.9
- Boards
- 36
USB_C_Receptacle_Amphenol_12401610E4-2A
Connector_USB
USB TYPE C, RA RCPT PCB, SMT, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401610E4%7e2A
- Pads
- 25
- SMD
- 10.8×11.6
- Boards
- 32
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
SOP-24_7.5x15.4mm_P1.27mm
Package_SO
SOP, 24 Pin (http://www.issi.com/WW/pdf/31FL3218.pdf#page=14)
- Pads
- 24
- SMD
- 11.8×15.9
- Boards
- 25
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 24
VQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 22
LGA-24L_3x3.5mm_P0.43mm
Package_LGA
LGA 24L 3x3.5mm Pitch 0.43mm
- Pads
- 24
- SMD
- 4.2×3.7
- Boards
- 22
LQFP-176_24x24mm_P0.5mm
Package_QFP
LQFP, 176 Pin (https://www.st.com/resource/en/datasheet/stm32f207vg.pdf#page=163)
- Pads
- 176
- SMD
- 27.4×27.4
- Boards
- 22
TE_2-1734839-4_1x24-1MP_P0.5mm_Horizontal
Connector_FFC-FPC
TE FPC connector, 24 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0
- Pads
- 25
- SMD
- 18.4×6.7
- Boards
- 21
USB_C_Receptacle_Amphenol_12401548E4-2A
Connector_USB
USB TYPE C, RA RCPT PCB, Hybrid, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401548E4%7e2A
- Pads
- 25
- SMD
- 10.8×11.6
- Boards
- 21
Jack_3.5mm_CUI_SJ-3524-SMT_Horizontal
Connector_Audio
3.5 mm, Stereo, Right Angle, Surface Mount (SMT), Audio Jack Connector (https://www.cui.com/product/resource/sj-352x-smt-series.pdf)
- Pads
- 4
- SMD
- 11.2×20.6
- Boards
- 20
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 20
SO-24_5.3x15mm_P1.27mm
Package_SO
SO, 24 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 24
- SMD
- 9.4×15.5
- Boards
- 19
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 18
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 16