Footprints
275 footprints matching “36”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOT-363_SC-70-6
Package_TO_SOT_SMD
SOT, 6 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf#page=170, JEDEC MO-203, variant AB, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203)
- Pads
- 6
- SMD
- 2.9×2.2
- Boards
- 586
SW_Tactile_SPST_NO_Straight_CK_PTS636Sx25SMTRLFS
Button_Switch_SMD
Tactile switch, SPST, 6.0x3.5 mm, H2.5 mm, straight, NO, gull wing leads: https://www.ckswitches.com/media/2779/pts636.pdf
- Pads
- 2
- SMD
- 9.5×4.2
- Boards
- 90
QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm
Package_DFN_QFN
QFN, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf)
- Pads
- 37
- SMD
- 7.2×7.2
- Boards
- 40
BarrelJack_CUI_PJ-036AH-SMT_Horizontal
Connector_BarrelJack
Surface-mount DC Barrel Jack, http://www.cui.com/product/resource/pj-036ah-smt.pdf
- Pads
- 3
- SMD
- 17.8×19.0
- Boards
- 21
DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 15
QFN-36-1EP_6x6mm_P0.5mm_EP4.1x4.1mm
Package_DFN_QFN
QFN, 36 Pin (www.st.com/resource/en/datasheet/stm32f101t6.pdf#page=72)
- Pads
- 37
- SMD
- 7.3×7.3
- Boards
- 12
CP_EIA-7361-38_AVX-V
Capacitor_Tantalum_SMD
Tantalum Capacitor SMD AVX-V (7361-38 Metric), IPC-7352 nominal, (Body size from: http://datasheets.avx.com/NOS.pdf)
- Pads
- 2
- SMD
- 8.7×6.6
- Boards
- 11
D_2114_3652Metric_Pad1.85x3.75mm_HandSolder
Diode_SMD
Diode SMD 2114 (3652 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/schottky.pdf)
- Pads
- 2
- SMD
- 6.9×4.3
- Boards
- 10
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
L_Wuerth_HCI-1365
Inductor_SMD
Inductor, Wuerth, HCI-1365, 12.8x12.8x6.2mm, (https://www.we-online.com/components/products/datasheet/744355122.pdf)
- Pads
- 2
- SMD
- 15.5×13.3
- Boards
- 8
Texas_RHH0036C_VQFN-36-1EP_6x6mm_P0.5mm_EP4.4x4.4mm_ThermalVias
Package_DFN_QFN
Texas RHH0036C VQFN, 36 Pin (http://www.ti.com/lit/ds/slvsba5d/slvsba5d.pdf#page=37)
- Pads
- 37
- SMD
- 7.3×7.3
- Boards
- 6
Mini-Circuits_CD636_LandPatternPL-035
RF_Mini-Circuits
Footprint for Mini-Circuits case CD636 (https://ww2.minicircuits.com/case_style/CD636.pdf) following land pattern PL-035, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf)
- Pads
- 6
- SMD
- 8.1×8.4
- Boards
- 6
QFN-36-1EP_5x6mm_P0.5mm_EP3.6x4.1mm_ThermalVias
Package_DFN_QFN
QFN, 36 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf#page=43)
- Pads
- 37
- SMD
- 6.3×7.3
- Boards
- 5
Laird_Technologies_BMI-S-209-F_29.36x18.50mm
RF_Shielding
Laird Technologies BMI-S-209-F Shielding Cabinet Two Piece SMD 29.36x18.50mm, http://cdn.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf
- Pads
- 1
- SMD
- 30.7×19.8
- Boards
- 5
CP_EIA-7360-38_Kemet-E
Capacitor_Tantalum_SMD
Tantalum Capacitor SMD Kemet-E (7360-38 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)
- Pads
- 2
- SMD
- 8.8×6.5
- Boards
- 4
D_2114_3652Metric
Diode_SMD
Diode SMD 2114 (3652 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/schottky.pdf)
- Pads
- 2
- SMD
- 6.6×4.3
- Boards
- 4
QFN-36-1EP_6x6mm_P0.5mm_EP4.1x4.1mm_ThermalVias
Package_DFN_QFN
QFN, 36 Pin (www.st.com/resource/en/datasheet/stm32f101t6.pdf#page=72)
- Pads
- 37
- SMD
- 7.3×7.3
- Boards
- 4
L_Chilisin_BMRG00131360
Inductor_SMD
Inductor, Chilisin, BMRG00131360, 13.8x12.6x6.0mm, (https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf)
- Pads
- 2
- SMD
- 15.0×13.1
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 3
CP_EIA-7361-438_AVX-U
Capacitor_Tantalum_SMD
Tantalum Capacitor SMD AVX-U (7361-438 Metric), IPC-7352 nominal, (Body size from: http://datasheets.avx.com/NOS.pdf)
- Pads
- 2
- SMD
- 8.7×6.6
- Boards
- 2
Molex_Micro-Fit_3.0_43650-0224_1x02-1MP_P3.00mm_Vertical
Connector_Molex
Molex Micro-Fit 3.0 Connector System, 43650-0224 (compatible alternatives: 43650-0225, 43650-0226), 2 Pins per row (https://www.molex.com/pdm_docs/sd/436500224_sd.pdf)
- Pads
- 3
- SMD
- 15.2×7.6
- Boards
- 2
Molex_Micro-Fit_3.0_43650-0310_1x03-1MP_P3.00mm_Horizontal
Connector_Molex
Molex Micro-Fit 3.0 Connector System, 43650-0310 (compatible alternatives: 43650-0311, 43650-0309), 3 Pins per row (https://www.molex.com/pdm_docs/sd/436500210_sd.pdf)
- Pads
- 4
- SMD
- 13.7×12.5
- Boards
- 2
Molex_Micro-Fit_3.0_43650-0321_1x03_P3.00mm_Vertical
Connector_Molex
Molex Micro-Fit 3.0 Connector System, 43650-0321 (compatible alternatives: 43650-0322, 43650-0323), 3 Pins per row (https://www.molex.com/pdm_docs/sd/436500221_sd.pdf)
- Pads
- 3
- SMD
- 13.7×7.6
- Boards
- 2
Molex_Micro-Fit_3.0_43650-0521_1x05_P3.00mm_Vertical
Connector_Molex
Molex Micro-Fit 3.0 Connector System, 43650-0521 (compatible alternatives: 43650-0522, 43650-0523), 5 Pins per row (https://www.molex.com/pdm_docs/sd/436500221_sd.pdf)
- Pads
- 5
- SMD
- 19.7×7.6
- Boards
- 2