HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Footprint

33 pads
Footprint HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Mount
Surface mount
Courtyard
9 × 11.6 mm
Pads
33
File
17 KB

3D model

STEP

Package_SO_HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm

8.30 × 11 × 1.60 mm

414 KB STEP

Library
Package_SO_HTSSOP-32-1EP_6.1x11mm_P0.65mm
Model page
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Parts that use it

1 component in the catalog place this footprint

On real boards

The largest boards that carry it

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception