Footprints
682 footprints matching “3mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm
Jumper
SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open
- Pads
- 2
- SMD
- 3.3×2.5
- Boards
- 1,497
SolderJumper-2_P1.3mm_Open_TrianglePad1.0x1.5mm
Jumper
SMD Solder Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, open
- Pads
- 2
- SMD
- 3.3×2.5
- Boards
- 709
SolderJumper-2_P1.3mm_Bridged_RoundedPad1.0x1.5mm
Jumper
SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip
- Pads
- 2
- SMD
- 3.3×2.5
- Boards
- 620
SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm
Jumper
SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open
- Pads
- 2
- SMD
- 3.3×2.5
- Boards
- 561
MSOP-8_3x3mm_P0.65mm
Package_SO
MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)
- Pads
- 8
- SMD
- 6.4×3.5
- Boards
- 348
SolderJumper-3_P1.3mm_Open_RoundedPad1.0x1.5mm
Jumper
SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open
- Pads
- 3
- SMD
- 4.6×2.5
- Boards
- 339
MSOP-10_3x3mm_P0.5mm
Package_SO
MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)
- Pads
- 10
- SMD
- 6.2×3.5
- Boards
- 333
SOIC-16W_7.5x10.3mm_P1.27mm
Package_SO
SOIC, 16 Pin (JEDEC MS-013AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/rw_16.pdf)
- Pads
- 16
- SMD
- 11.9×10.8
- Boards
- 282
SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm
Jumper
SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip
- Pads
- 2
- SMD
- 3.3×2.5
- Boards
- 227
SolderJumper-3_P1.3mm_Bridged12_RoundedPad1.0x1.5mm
Jumper
SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip
- Pads
- 3
- SMD
- 4.6×2.5
- Boards
- 222
SolderJumper-3_P1.3mm_Open_RoundedPad1.0x1.5mm_NumberLabels
Jumper
SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open, labeled with numbers
- Pads
- 3
- SMD
- 4.6×2.5
- Boards
- 196
TSSOP-8_4.4x3mm_P0.65mm
Package_SO
TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 8
- SMD
- 7.7×3.5
- Boards
- 179
SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm
Jumper
SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open
- Pads
- 3
- SMD
- 4.6×2.5
- Boards
- 156
TSSOP-10_3x3mm_P0.5mm
Package_SO
TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)
- Pads
- 10
- SMD
- 6.3×3.5
- Boards
- 153
SOIC-8_5.3x5.3mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)
- Pads
- 8
- SMD
- 9.3×5.8
- Boards
- 139
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 135
SolderJumper-3_P1.3mm_Bridged12_RoundedPad1.0x1.5mm_NumberLabels
Jumper
SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip, labeled with numbers
- Pads
- 3
- SMD
- 4.6×2.5
- Boards
- 134
TSSOP-8_3x3mm_P0.65mm
Package_SO
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)
- Pads
- 8
- SMD
- 5.9×3.6
- Boards
- 111
SolderJumper-2_P1.3mm_Bridged2Bar_RoundedPad1.0x1.5mm
Jumper
SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 2 copper strips
- Pads
- 2
- SMD
- 3.3×2.5
- Boards
- 110
SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm_NumberLabels
Jumper
SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open, labeled with numbers
- Pads
- 3
- SMD
- 4.6×2.5
- Boards
- 93
SolderJumper-3_P1.3mm_Bridged12_Pad1.0x1.5mm
Jumper
SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip
- Pads
- 3
- SMD
- 4.6×2.5
- Boards
- 89
QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm
Package_DFN_QFN
QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)
- Pads
- 21
- SMD
- 4.3×4.3
- Boards
- 83
InvenSense_QFN-24_3x3mm_P0.4mm
Sensor_Motion
24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 4.1×4.1
- Boards
- 74
SolderJumper-2_P1.3mm_Bridged2Bar_Pad1.0x1.5mm
Jumper
SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 2 copper strips
- Pads
- 2
- SMD
- 3.3×2.5
- Boards
- 68