Footprints

26 footprints matching “55mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

26 footprints · page 1 of 2

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TSOP-I-28_11.8x8mm_P0.55mm

FP3D

Package_SO

TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)

Pads: 28
SMD: 14.9×8.7
Boards: 6

Texas_RGY_R-PVQFN-N16_EP2.05x2.55mm

FP—

Package_DFN_QFN

QFN, 16 Pin (https://www.ti.com/lit/ds/symlink/ts5v330.pdf#page=28)

Pads: 17
SMD: 4.8×5.3
Boards: 4

SOP-8_6.605x9.655mm_P2.54mm

FP3D

Package_SO

SOP, 8 Pin (https://www.onsemi.com/pdf/datasheet/hcpl2631m-d.pdf)

Pads: 8
SMD: 11.5×10.2
Boards: 3

Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelC

FP—

Package_BGA

Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf

Pads: 6
SMD: 1.9×2.3
Boards: 2

WQFN-42-1EP_3.5x9mm_P0.5mm_EP2.05x7.55mm

FP—

Package_DFN_QFN

WQFN, 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23, https://www.diodes.com/assets/Package-Files/PD-2035J_ZH42.pdf)

Pads: 43
SMD: 4.8×10.3
Boards: 2

ST_UFDFPN-12-1EP_3x3mm_P0.5mm_EP1.4x2.55mm

FP—

Package_DFN_QFN

ST UFDFPN, 12 Pin (https://www.st.com/resource/en/datasheet/st25dv04k.pdf#page=152)

Pads: 13
SMD: 4.3×3.5
Boards: 1

CAP 1812_4532 2.55MM

FP—

celestial-altium-Capacitor_MLCC

Chip Capacitor, 2-Leads, Body 4.50x3.20mm, IPC Medium Density

Pads: 2
SMD: 6.0×4.0
Boards: —

SOIC-6-5_W4.55mm

FP—

digikey-digikey-footprints

Pads: 5
SMD: 4.2×8.0
Boards: —

SOIC-6-5_W4.55mm

FP—

digikey-Source_Footprints

Pads: 5
SMD: 4.2×8.0
Boards: —

ISSI_TSOP-I-28_11.8x8mm_P0.55mm

FP—

gekkio-Gekkio_Package_SO

http://www.issi.com/WW/pdf/61LV256AL.pdf

Pads: 28
SMD: 9.0×14.7
Boards: —

Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelB

FP—

Package_BGA

Pads: 6
SMD: 2.9×3.3
Boards: —

VFBGA-86_6x6mm_Layout10x10_P0.55mm

FP—

Package_BGA

VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740

Pads: 86
SMD: 8.0×8.0
Boards: —

ST_WLCSP-27_2.34x2.55mm_Layout9x6_P0.4mm_Stagger

FP3D

Package_CSP

ST WLCSP-27, ST Die ID 459, 2.34x2.55mm, 27 Ball, X-staggered 9x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u031g6.pdf#page=105

Pads: 27
SMD: 4.3×4.6
Boards: —

WLCSP-12_1.403x1.555mm_Layout6x4_P0.4mm_Stagger

FP—

Package_CSP

WLCSP-12, staggered array, 1.403x1.555mm, 12 Ball, X-staggered 6x4 Layout, 0.4mm Pitch, http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208

Pads: 12
SMD: 3.4×3.6
Boards: —