Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelC
Package_BGA
Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf
Footprint
6 pads- Mount
- Surface mount
- Courtyard
- 1.86 × 2.26 mm
- Pads
- 6
- File
- 6 KB
3D model
noneno 3D model
This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.
On real boards
The largest boards that carry it
| Design | Parts | Nets | Layers | Board | Licence | Source |
|---|---|---|---|---|---|---|
| GAFx | 132 | 229 | 4 | 107.12 × 32.4 mm | CC-BY-4.0 | AnterCreeper/gAFx ↗ |
| INHA UNIV STM32 FC Hw BOARD2 | 129 | 139 | 4 | 39 × 48.5 mm | CC-BY-4.0 | NARAE-INHA-UNIV/STM32-FC-hw ↗ |
Provenance
- Source
- kicad-footprints
- Credit
- KiCad Libraries Contributors
- Licence
- CC-BY-SA-4.0-with-KiCad-exception
