Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelC

Package_BGA

Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf

Footprint

6 pads
Footprint Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelC
Mount
Surface mount
Courtyard
1.86 × 2.26 mm
Pads
6
File
6 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
GAFx1322294107.12 × 32.4 mmCC-BY-4.0AnterCreeper/gAFx
INHA UNIV STM32 FC Hw BOARD2129139439 × 48.5 mmCC-BY-4.0NARAE-INHA-UNIV/STM32-FC-hw

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception