Footprints

47 footprints matching “6.5mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints on their own, whether or not a symbol uses them.

47 footprints · page 1 of 2

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TSSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 20
SMD: 7.7×7.0
Boards: 731

SSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)

Pads: 20
SMD: 7.8×7.0
Boards: 39

L_Sumida_CDMC6D28_7.25x6.5mm

FP—

Inductor_SMD

SMD Power Inductor (http://products.sumida.com/products/pdf/CDMC6D28.pdf)

Pads: 2
SMD: 8.2×7.0
Boards: 8

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 21
SMD: 7.9×7.1
Boards: 7

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias

FP3D

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads: 21
SMD: 7.8×7.0
Boards: 6

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.85x4mm

FP—

Package_SO

HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 21
SMD: 7.7×7.0
Boards: 4

LQFP-64-1EP_10x10mm_P0.5mm_EP6.5x6.5mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/98ARH98426A.pdf)

Pads: 65
SMD: 13.3×13.3
Boards: 3

SSOP-18_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)

Pads: 18
SMD: 6.9×7.0
Boards: 3

QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm

FP3D

Package_DFN_QFN

QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)

Pads: 65
SMD: 9.2×9.2
Boards: 2

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.74x3.86mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24)

Pads: 21
SMD: 7.7×7.0
Boards: 2

L_CommonModeChoke_Wuerth_WE-SL5

FP—

Inductor_SMD

WE-SL5 SMT Common Mode Line Filter, 10x8.7mm, height 6.5mm, https://www.we-online.com/components/products/datasheet/744272121.pdf

Pads: 4
SMD: 9.4×10.8
Boards: 1

QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)

Pads: 65
SMD: 9.2×9.2
Boards: 1

LQFP-64-1EP_10x10mm_P0.5mm_EP6.5x6.5mm_ThermalVias

FP3D

Package_QFP

LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/98ARH98426A.pdf)

Pads: 65
SMD: 13.3×13.3
Boards: 1

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.4x3.7mm

FP—

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/bq24006.pdf)

Pads: 21
SMD: 7.8×7.0
Boards: 1

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.96x2.96mm_ThermalVias

FP—

Package_SO

HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49)

Pads: 21
SMD: 7.8×7.0
Boards: 1

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_ThermalVias

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads: 21
SMD: 7.9×7.1
Boards: 1

TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm

FP—

Package_SO

TSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100132.PDF)

Pads: 21
SMD: 7.8×7.0
Boards: 1