Footprints

52 footprints matching “66”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

52 footprints · page 1 of 3

Matched by name and keywords. Search by meaning instead

SOT-666

FP3D

Package_TO_SOT_SMD

SOT666

Pads: 6
SMD: 3.0×2.2
Boards: 194

SSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)

Pads: 20
SMD: 7.8×7.0
Boards: 39

ESP-WROOM-02

FP3D

RF_Module

https://www.espressif.com/sites/default/files/documentation/0c-esp-wroom-02_datasheet_en.pdf

Pads: 19
SMD: 28.5×25.5
Boards: 26

DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)

Pads: 9
SMD: 4.0×3.6
Boards: 23

LFPAK56

FP3D

Package_TO_SOT_SMD

LFPAK56 https://assets.nexperia.com/documents/outline-drawing/SOT669.pdf

Pads: 5
SMD: 7.3×5.5
Boards: 22

C_2225_5664Metric_Pad1.80x6.60mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads: 2
SMD: 7.6×7.1
Boards: 10

Laird_Technologies_BMI-S-201-F_13.66x12.70mm

FP—

RF_Shielding

Laird Technologies BMI-S-201-F Shielding Cabinet Two Piece SMD 13.66x12.70mm, http://cdn.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf

Pads: 1
SMD: 14.0×15.0
Boards: 10

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

Freescale_98ARH99066A

FP—

Sensor_Pressure

https://www.nxp.com/docs/en/data-sheet/MPXH6250A.pdf

Pads: 8
SMD: 12.0×8.5
Boards: 4

C_2225_5664Metric

FP3D

Capacitor_SMD

Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads: 2
SMD: 7.2×7.1
Boards: 3

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: 3

SOT-665

FP3D

Package_TO_SOT_SMD

SOT665

Pads: 5
SMD: 2.9×2.2
Boards: 3

Laird_Technologies_BMI-S-101_13.66x12.70mm

FP—

RF_Shielding

Laird Technologies BMI-S-101 Shielding Cabinet One Piece SMD 13.66x12.70mm, http://cdn.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf

Pads: 1
SMD: 14.0×15.0
Boards: 3

QFN-48-1EP_6x6mm_P0.4mm_EP4.66x4.66mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.onsemi.com/pub/Collateral/485BA.PDF)

Pads: 49
SMD: 7.2×7.2
Boards: 2

R_Shunt_Vishay_WSK2512_6332Metric_T2.66mm

FP—

Resistor_SMD

Shunt Resistor SMD 2512 (6332 Metric), 2.6mm thick, Vishay WKS2512, Terminal length (T) 2.66mm, 0.5 to 0.99 milli Ohm (http://http://www.vishay.com/docs/30108/wsk.pdf)

Pads: 4
SMD: 8.8×3.8
Boards: 2

Quectel_BC66

FP—

RF_GSM

GSM NB-IoT module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf

Pads: 58
SMD: 21.8×23.7
Boards: 2

Olimex_MOD-WIFI-ESP8266-DEV

FP—

Module

ESP8266 development board https://www.olimex.com/Products/IoT/ESP8266/MOD-WIFI-ESP8266-DEV/resources/dimensions-WIFI-ESP8266-DEV.png

Pads: 22
SMD: 26.4×34.0
Boards: 1

DFN-12-1EP_4x4mm_P0.5mm_EP2.66x3.38mm

FP3D

Package_DFN_QFN

DF Package; 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf)

Pads: 13
SMD: 5.0×4.6
Boards: 1

QFN-48-1EP_6x6mm_P0.4mm_EP4.66x4.66mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.onsemi.com/pub/Collateral/485BA.PDF)

Pads: 49
SMD: 7.2×7.2
Boards: 1

SOT-666

FP3D

agg-agg

Pads: 6
SMD: 2.7×2.2
Boards: —

SW_DIP_SPSTx12_Slide_9.78x32.66mm_W8.61mm_P2.54mm

FP3D

Button_Switch_SMD

SMD 12x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x32.66mm (see e.g. https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD

Pads: 24
SMD: 11.6×33.3
Boards: —