Footprints

19 footprints matching “8E”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

19 footprints

Matched by name and keywords. Search by meaning instead

Diodes_SO-8EP

FP—

Package_SO

8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf)

Pads: 9
SMD: 7.0×5.1
Boards: 22

USB_C_Receptacle_Amphenol_12401548E4-2A

FP—

Connector_USB

USB TYPE C, RA RCPT PCB, Hybrid, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401548E4%7e2A

Pads: 25
SMD: 10.8×11.6
Boards: 21

LED_Kingbright_AAA3528ESGCT

FP—

LED_SMD

Kingbright, dual LED, 3.5 x 2.8 mm Surface Mount LED Lamp (http://www.kingbrightusa.com/images/catalog/SPEC/AAA3528ESGCT.pdf)

Pads: 4
SMD: 4.5×3.3
Boards: 7

AD SOIC-8EP RD-8-1

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 2.39x2.39mm, IPC Medium Density

Pads: 9
SMD: 7.4×5.5
Boards: —

AD SOIC-8EP RD-8-2

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 3.10x2.41mm, IPC Medium Density

Pads: 9
SMD: 7.4×5.5
Boards: —

TI SOIC-8 DDA0008E

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 3.10x2.40mm, IPC Medium Density

Pads: 9
SMD: 8.5×5.3
Boards: —

DIODES INC SO-8EP

FP—

celestial-altium-Leaded_SOP

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 3.60x2.70mm, IPC Medium Density

Pads: 9
SMD: 7.4×5.6
Boards: —

DIODES MSOP-8EP

FP—

celestial-altium-Leaded_SOP

MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 2.00x1.70mm, IPC Medium Density

Pads: 9
SMD: 6.2×3.6
Boards: —

LT MSOP-8 MS8E 3x3MM

FP—

celestial-altium-Leaded_SOP

MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density

Pads: 9
SMD: 6.3×3.6
Boards: —

TI MicroSiP-8 SIL0008E

FP—

celestial-altium-Power_Module

MicroSIP, 8-Leads, Body 3.50x3.50mm, Pitch 0.80mm, Thermal Pad 0.00x0.00mm, IPC Medium Density

Pads: 9
SMD: 4.4×4.1
Boards: —

USB_C_Receptacle_Amphenol_12401548E4-2A_CircularHoles

FP—

Connector_USB

USB TYPE C, RA RCPT PCB, Hybrid, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401548E4%7e2A

Pads: 25
SMD: 11.4×11.6
Boards: —

USB_C_Receptacle_Amphenol_12401948E412A

FP—

Connector_USB

USB TYPE C, USB 2.0, SMT, https://cdn.amphenol-cs.com/media/wysiwyg/files/drawing/c12401948.pdf

Pads: 17
SMD: 13.7×12.8
Boards: —

Oscillator_MEMS_SIT1533AI-H4-DCC-32.768E

FP—

digikey-digikey-footprints

https://www.sitime.com/products/datasheets/sit1533/SiT1533-datasheet.pdf

Pads: 4
SMD: 2.5×2.0
Boards: —

Oscillator_MEMS_SIT1533AI-H4-DCC-32.768E

FP—

digikey-Source_Footprints

https://www.sitime.com/products/datasheets/sit1533/SiT1533-datasheet.pdf

Pads: 4
SMD: 2.5×2.0
Boards: —

Microchip_8E-16

FP—

Package_DFN_QFN

16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 17
SMD: 5.0×5.0
Boards: —

Texas_PHP0048E_HTQFP-48-1EP_7x7mm_P0.5mm_EP6.5x6.5mm_Mask3.62x3.62mm

FP—

Package_QFP

Texas PHP0048E HTQFP, 48 Pin (https://www.ti.com/lit/ds/symlink/tusb4020bi.pdf#page=42)

Pads: 49
SMD: 10.4×10.4
Boards: —

Texas_PHP0048E_HTQFP-48-1EP_7x7mm_P0.5mm_EP6.5x6.5mm_Mask3.62x3.62mm_ThermalVias

FP—

Package_QFP

Texas PHP0048E HTQFP, 48 Pin (https://www.ti.com/lit/ds/symlink/tusb4020bi.pdf#page=42)

Pads: 49
SMD: 10.4×10.4
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm_ThermalVias

FP—

Package_SO

Pads: 39
SMD: 7.7×10.2
Boards: —