Footprints

21 footprints matching “900”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

21 footprints

Matched by name and keywords. Search by meaning instead

Harwin_M20-89004xx_1x04_P2.54mm_Horizontal

FP—

Connector_Harwin

Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89004xx, 4 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf)

Pads: 4
SMD: 14.6×11.2
Boards: 5

Balun_Johanson_0900FM15K0039

FP3D

RF_Converter

Johanson 0900FM15K0039 DFN, 10 Pin (https://www.johansontechnology.com/datasheets/0900FM15K0039/0900FM15K0039.pdf)

Pads: 10
SMD: 2.5×3.3
Boards: 5

Harwin_M20-89003xx_1x03_P2.54mm_Horizontal

FP—

Connector_Harwin

Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89003xx, 3 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf)

Pads: 3
SMD: 14.6×8.6
Boards: 4

Harwin_M20-89006xx_1x06_P2.54mm_Horizontal

FP—

Connector_Harwin

Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89006xx, 6 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf)

Pads: 6
SMD: 14.6×16.2
Boards: 4

Harwin_M20-89005xx_1x05_P2.54mm_Horizontal

FP—

Connector_Harwin

Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89005xx, 5 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf)

Pads: 5
SMD: 14.6×13.7
Boards: 2

Harwin_M20-89008xx_1x08_P2.54mm_Horizontal

FP—

Connector_Harwin

Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89008xx, 8 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf)

Pads: 8
SMD: 14.6×21.3
Boards: 2

SIMCom_SIM900

FP—

RF_GSM

Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf

Pads: 68
SMD: 26.1×26.1
Boards: 1

AMD XILINX FCBGA-900 FFG900 31X31

FP—

celestial-altium-Leadless_BGA

FCBGA, 900-Leads, Body 31.00x31.00mmx3.35mm, Pitch 1.00mm

Pads: 900
SMD: 31.5×31.5
Boards: —

JOHANSON 0900LP15B0063001E

FP—

celestial-altium-RF_Filter

Ceramic filter, Sub-1GHz

Pads: 4
SMD: 4.0×3.4
Boards: —

Harwin_M20-89007xx_1x07_P2.54mm_Horizontal

FP—

Connector_Harwin

Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89007xx, 7 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf)

Pads: 7
SMD: 14.6×18.8
Boards: —

Harwin_M20-89009xx_1x09_P2.54mm_Horizontal

FP—

Connector_Harwin

Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89009xx, 9 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf)

Pads: 9
SMD: 14.6×23.9
Boards: —

Molex_DuraClik_502352-0900_1x09-1MP_P2.00mm_Horizontal

FP—

Connector_Molex

Molex DuraClik series connector, 502352-0900 (http://www.molex.com/pdm_docs/sd/5023520200_sd.pdf)

Pads: 10
SMD: 23.8×10.8
Boards: —

USB_Micro_AB_Female_0475890001

FP—

digikey-digikey-footprints

http://www.molex.com/pdm_docs/sd/475890001_sd.pdf

Pads: 6
SMD: 10.1×6.1
Boards: —

USB_Micro_AB_Female_0475890001

FP—

digikey-Source_Footprints

http://www.molex.com/pdm_docs/sd/475890001_sd.pdf

Pads: 6
SMD: 10.1×6.1
Boards: —

CRYSTAL-SMD_4P-L3.2-W2.5-BL

FP—

jlcpcb-JLCPCB

CRYSTAL-SMD_4P-L3.2-W2.5-BL footprint

Pads: 4
SMD: 3.6×2.8
Boards: —

E22-900M30S

FP—

kiml-00-kiml-rf-module

Pads: 22
SMD: 26.0×39.5
Boards: —

Xilinx_FBG900

FP—

Package_BGA

Kintex-7 BGA, NSMD pad definition Appendix A, 31x31mm, 900 Ball, 30x30 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289

Pads: 900
SMD: 33.0×33.0
Boards: —

Xilinx_FFG900_FFG901

FP—

Package_BGA

Kintex-7 and Zynq-7000 BGA, NSMD pad definition Appendix A, 31x31mm, 900 Ball, 30x30 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90

Pads: 900
SMD: 33.0×33.0
Boards: —

Xilinx_RF900

FP—

Package_BGA

Kintex-7 and Zynq-7000 BGA, NSMD pad definition Appendix A, 31x31mm, 900 Ball, 30x30 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94

Pads: 900
SMD: 33.0×33.0
Boards: —

DIP-64_W22.86mm_SMDSocket_SmallPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), SMDSocket, SmallPads

Pads: 64
SMD: 25.9×81.9
Boards: —

Balun_Johanson_0900PC15J0013

FP3D

RF_Converter

Johanson 0900PC15J0013 DFN, 10 Pin (https://www.johansontechnology.com/datasheets/0900PC15J0013/0900PC15J0013.pdf)

Pads: 10
SMD: 2.6×3.3
Boards: —