68 footprints matching “NC”

Resistor_SMD

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf)

Pads

8

SMD

3.1×3.8

Boards

78

Connector_USB

USB type A Plug, Horizontal, http://cnctech.us/pdfs/1001-011-01101.pdf

Pads

5

SMD

22.8×14.3

Boards

40

Resistor_SMD

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA04P (see cra04p.pdf)

Pads

8

SMD

2.0×2.5

Boards

39

Package_DIP

4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads

4

SMD

11.5×5.6

Boards

18

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads

8

SMD

13.1×6.4

Boards

13

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads

5

SMD

7.3×5.8

Boards

9

Package_DIP

6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads

6

SMD

11.5×8.1

Boards

6

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf

Pads

8

SMD

11.9×10.3

Boards

4

Resistor_SMD

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf)

Pads

4

SMD

3.1×2.1

Boards

4

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads

8

SMD

11.5×10.7

Boards

2

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads

6

SMD

11.2×5.1

Boards

2

Connector_USB

USB Type-C 3.0 Receptacle, 24-pin, right angle (source: https://www.cnctech.us/pdfs/C-ARA1-AK512.pdf)

Pads

25

SMD

10.6×11.0

Boards

1

Package_BGA

Alliance TFBGA 54 pins, 8x8mm, 54 Ball, 9x9 Layout, 0.8mm Pitch, https://www.alliancememory.com/wp-content/uploads/pdf/dram/Alliance_Memory_64M-AS4C4M16SA-CI_v5.0_October_2018.pdf#page=54

Pads

54

SMD

10.0×10.0

Boards

1

Package_DFN_QFN

ArtInChip QFN, 68 Pin (https://artinchip.com/upload/files/product/20240112/17050529177725663.pdf/#page=42)

Pads

69

SMD

7.7×7.7

Boards

1

Package_SO

4-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf

Pads

4

SMD

11.9×5.6

Boards

1

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads

6

SMD

13.1×5.1

Boards

1

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads

8

SMD

11.2×6.4

Boards

1

Resistor_SMD

Power Metal Strip Resistors 0.005 to 0.2, https://www.vishay.com/docs/30101/wsr.pdf

Pads

2

SMD

13.6×7.5

Boards

1

agg-agg

Pads

2

SMD

3.3×1.5

Boards

—

celestial-altium-Connector_Misc

Pads

10

SMD

2.0×2.0

Boards

—

celestial-altium-Diodes

PowerDI5

Pads

2

SMD

7.8×4.6

Boards

—

celestial-altium-Diodes

SODFL, 2-Leads, Body 2.60x5.20mm, IPC Medium Density

Pads

2

SMD

6.3×3.3

Boards

—

celestial-altium-Leaded_SOP

TSOP, 54-Leads, Body 22.22x10.16mm, Pitch 0.80mm, IPC Medium Density

Pads

54

SMD

13.2×22.9

Boards

—

celestial-altium-Leaded_SOP

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, Thermal Pad 3.60x2.70mm, IPC Medium Density

Pads

9

SMD

7.4×5.6

Boards

—