Footprints

20 footprints matching “SIL”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

20 footprints

Matched by name and keywords. Search by meaning instead

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 18

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm_ThermalVias

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 1

SILICON LABS DFN-6 3x3MM

FP—

celestial-altium-Leadless_DFN

Temperature Sensor Digital - Local -40°C ~ 125°C, 6 Leads, Body 3x3mm, Package 6-VFDFN Exposed Pad

Pads: 7
SMD: 4.2×3.4
Boards: —

SILICON LABS QFN-28 5x5MM

FP—

celestial-altium-Leadless_QFN

QFN, 28-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.35x3.35mm, IPC Medium Density

Pads: 29
SMD: 6.2×6.2
Boards: —

Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias

FP—

Package_LGA

Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)

Pads: 9
SMD: 3.3×3.5
Boards: 14

SW_Push_1TS009xxxx-xxxx-xxxx_6x6x5mm

FP3D

Button_Switch_SMD

tactile push button, 6x6mm, height=5mm, 12V 50mA, https://datasheet.lcsc.com/lcsc/1811151231_HYP--Hongyuan-Precision-1TS009A-1800-5000-CT_C319409.pdf

Pads: 2
SMD: 8.5×6.5
Boards: 8

Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias

FP3D

Package_LGA

Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)

Pads: 11
SMD: 4.4×3.5
Boards: 5

Oscillator_SMD_Silicon_Labs_LGA-6_2.5x3.2mm_P1.25mm

FP—

Oscillator

Silicon_Labs LGA, 6 Pin (https://www.silabs.com/documents/public/data-sheets/si512-13.pdf)

Pads: 6
SMD: 3.0×3.7
Boards: 1

INTERSIL SOIC-20 WIDE

FP—

celestial-altium-Leaded_SOIC

SOIC, 20-Leads, Body 12.80x7.50mm, Pitch 1.27mm, IPC Medium Density

Pads: 20
SMD: 11.8×13.5
Boards: —

INTERSIL SOIC-8 M8.15

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Pads: 8
SMD: 7.4×5.5
Boards: —

INTERSIL MSOP-8 M8.118

FP—

celestial-altium-Leaded_SOP

MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density

Pads: 8
SMD: 6.3×3.6
Boards: —

INTERSIL SSOP-20

FP—

celestial-altium-Leaded_SOP

SSOP, 20-Leads, Body 7.20x5.29mm, Pitch 0.65mm, IPC Medium Density

Pads: 20
SMD: 9.2×7.9
Boards: —

INTERSIL TSSOP-24 M24.173

FP—

celestial-altium-Leaded_SOP

TSSOP, 24-Leads, Body 7.80x4.40mm, Pitch 0.65mm, IPC Medium Density

Pads: 24
SMD: 7.8×8.4
Boards: —

INTERSIL TSSOP-28 M28.173

FP—

celestial-altium-Leaded_SOP

TSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, IPC Medium Density

Pads: 28
SMD: 7.8×10.3
Boards: —

TI MicroSiP-8 SIL0008E

FP—

celestial-altium-Power_Module

MicroSIP, 8-Leads, Body 3.50x3.50mm, Pitch 0.80mm, Thermal Pad 0.00x0.00mm, IPC Medium Density

Pads: 9
SMD: 4.4×4.1
Boards: —

Osram_SFH2201

FP—

OptoDevice

PhotoDiode, Clear Silicone, Osram TOPLED, 4x5.09mm, area: 2.85x2.85mm, Orientation mark at cathode, https://dammedia.osram.info/media/resource/hires/osram-dam-25688470/SFH%202201%20A01_EN.pdf

Pads: 2
SMD: 5.8×4.5
Boards: —