Footprints

14 footprints matching “SIP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

14 footprints

Matched by name and keywords. Search by meaning instead

Sipeed-M1

FP3D

Module

MAIX Dual Core RISC-V MCU, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications

Pads: 72
SMD: 27.0×27.0
Boards: —

Sipeed-M1W

FP3D

Module

MAIX RISC-V Dual Core MCU with wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications

Pads: 72
SMD: 27.0×27.0
Boards: —

Maxim_OLGA-14_3.3x5.6mm_P0.8mm

FP—

OptoDevice

https://pdfserv.maximintegrated.com/land_patterns/90-0602.PDF

Pads: 14
SMD: 3.8×6.1
Boards: 15

Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias

FP—

Package_LGA

Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)

Pads: 9
SMD: 3.3×3.5
Boards: 14

Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias

FP3D

Package_LGA

Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)

Pads: 11
SMD: 4.4×3.5
Boards: 5

TI MICROSIP-15 SIT0015A

FP—

celestial-altium-Power_Module

MicroSIP, 15-Leads, Body 3.50x3.50mm

Pads: 15
SMD: 4.2×4.1
Boards: —

TI MicroSiP-8 SIL0008E

FP—

celestial-altium-Power_Module

MicroSIP, 8-Leads, Body 3.50x3.50mm, Pitch 0.80mm, Thermal Pad 0.00x0.00mm, IPC Medium Density

Pads: 9
SMD: 4.4×4.1
Boards: —

Hamamatsu_S14160-6050HS

FP—

OptoDevice

Hamamatsu single MPPC, 6x6mm, 50um pixel pitch, 14331 pixels, 57% geometric fill factor, https://www.hamamatsu.com/content/dam/hamamatsu-photonics/sites/documents/99_SALES_LIBRARY/ssd/s14160_s14161_series_kapd1064e.pdf

Pads: 2
SMD: 6.6×6.6
Boards: —