Footprints
1,034 footprints matching “TH,”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
ESP32-WROOM-32
RF_Module
Single 2.4 GHz Wi-Fi and Bluetooth combo chip https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32_datasheet_en.pdf
- Pads
- 39
- SMD
- 48.0×41.3
- Boards
- 548
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
ESP32-S3-WROOM-1
RF_Module
2.4 GHz Wi-Fi and Bluetooth module https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf
- Pads
- 41
- SMD
- 48.0×41.2
- Boards
- 253
ESP32-WROOM-32D
RF_Module
2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32d_esp32-wroom-32u_datasheet_en.pdf
- Pads
- 39
- SMD
- 48.5×41.5
- Boards
- 155
USB_Micro-B_Wuerth_629105150521
Connector_USB
USB Micro-B receptacle, http://www.mouser.com/ds/2/445/629105150521-469306.pdf
- Pads
- 6
- SMD
- 9.9×8.2
- Boards
- 106
TI_SO-PowerPAD-8_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 103
SW_SPST_SKQG_WithStem
Button_Switch_SMD
ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, With stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAFE010.html
- Pads
- 2
- SMD
- 8.5×5.7
- Boards
- 101
SW_Push_1P1T_NO_Vertical_Wuerth_434133025816
Button_Switch_SMD
https://katalog.we-online.com/em/datasheet/434133025816.pdf
- Pads
- 2
- SMD
- 5.7×3.7
- Boards
- 81
ESP32-WROOM-32U
RF_Module
Single 2.4 GHz Wi-Fi and Bluetooth combo chip with U.FL connector, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32d_esp32-wroom-32u_datasheet_en.pdf
- Pads
- 39
- SMD
- 19.5×20.2
- Boards
- 72
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 60
microSD_HC_Wuerth_693072010801
Connector_Card
http://katalog.we-online.de/em/datasheet/693072010801.pdf
- Pads
- 9
- SMD
- 16.2×14.7
- Boards
- 58
SW_SPST_SKQG_WithoutStem
Button_Switch_SMD
ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, Without stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAEE010.html
- Pads
- 2
- SMD
- 8.5×5.7
- Boards
- 48
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf
- Pads
- 9
- SMD
- 8.4×5.5
- Boards
- 47
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
USB_Mini-B_Wuerth_65100516121_Horizontal
Connector_USB
Mini USB 2.0 Type B SMT Horizontal 5 Contacts (https://katalog.we-online.de/em/datasheet/65100516121.pdf)
- Pads
- 6
- SMD
- 11.8×10.8
- Boards
- 45
Texas_DRC0010J_ThermalVias
Package_SON
Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf
- Pads
- 11
- SMD
- 3.9×3.9
- Boards
- 45
ESP32-WROOM-32E
RF_Module
2.4 GHz Wi-Fi and Bluetooth 5 (LE) module: https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf
- Pads
- 39
- SMD
- 48.5×41.5
- Boards
- 41
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 40
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias
Package_SO
SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 38
Ai-Thinker-Ra-01-LoRa
RF_Module
Ai Thinker Ra-01 LoRa
- Pads
- 16
- SMD
- 18.5×18.0
- Boards
- 38
USB_Micro-B_Wuerth_629105150521_CircularHoles
Connector_USB
USB Micro-B receptacle, http://www.mouser.com/ds/2/445/629105150521-469306.pdf
- Pads
- 6
- SMD
- 10.6×8.2
- Boards
- 36
Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias
Package_SO
Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 34
VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias
Package_DFN_QFN
VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 33
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 31