Footprints

324 footprints matching “0.5mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

324 footprints · page 10 of 14

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Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf

Pads: 113
SMD: 9.0×9.0
Boards: —

Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Pads: 12
SMD: 4.5×4.0
Boards: —

Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Pads: 80
SMD: 6.0×6.0
Boards: —

TFBGA-64_5x5mm_Layout8x8_P0.5mm

FP3D

Package_BGA

TFBGA-64, 5.0x5.0mm, 64 Ball, 8x8 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f100v8.pdf#page=83

Pads: 64
SMD: 7.0×7.0
Boards: —

LFCSP-10_2x2mm_P0.5mm

FP3D

Package_CSP

LFCSP, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/cp_10_11.pdf)

Pads: 10
SMD: 3.2×3.2
Boards: —

LFCSP-16_3x3mm_P0.5mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_32.pdf)

Pads: 16
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-20-1EP_4x4mm_P0.5mm_EP2.1x2.1mm_ThermalVias

FP3D

Package_CSP

LFCSP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_6.pdf)

Pads: 21
SMD: 5.3×5.3
Boards: —

LFCSP-40-1EP_6x6mm_P0.5mm_EP4.65x4.65mm

FP3D

Package_CSP

LFCSP, 40 Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5))

Pads: 41
SMD: 7.3×7.3
Boards: —

LFCSP-40-1EP_6x6mm_P0.5mm_EP4.65x4.65mm_ThermalVias

FP3D

Package_CSP

LFCSP, 40 Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5))

Pads: 41
SMD: 7.3×7.3
Boards: —

LFCSP-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm

FP3D

Package_CSP

LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf)

Pads: 41
SMD: 7.3×7.3
Boards: —

LFCSP-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm_ThermalVias

FP3D

Package_CSP

LFCSP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf)

Pads: 41
SMD: 7.3×7.3
Boards: —

LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm_ThermalVias

FP3D

Package_CSP

LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)

Pads: 11
SMD: 4.3×3.5
Boards: —

NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm

FP3D

Package_CSP

NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf

Pads: 100
SMD: 7.1×7.1
Boards: —