Footprints
1,486 footprints matching “5mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PhoenixContact_MC_1,5_3-G-3.5_1x03_P3.50mm_Horizontal
Connector_Phoenix_MC
Generic Phoenix Contact connector footprint for: MC_1,5/3-G-3.5; number of pins: 03; pin pitch: 3.50mm; Angled || order number: 1844223 8A 160V
- Pads
- 3
- THT
- 13.0×10.8
- Boards
- 16
L_Radial_D7.0mm_P3.00mm
Inductor_THT
Inductor, Radial series, Radial, pin pitch=3.00mm, diameter=7mm, height=9.5mm, http://www.abracon.com/Magnetics/radial/AIUR-16.pdf
- Pads
- 2
- THT
- 7.5×7.5
- Boards
- 16
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
VSON-8_3.3x3.3mm_P0.65mm_NexFET
Package_SON
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf
- Pads
- 5
- SMD
- 4.0×3.8
- Boards
- 16
C_Axial_L12.0mm_D6.5mm_P20.00mm_Horizontal
Capacitor_THT
C, Axial series, Axial, Horizontal, pin pitch=20mm, length*diameter=12*6.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf
- Pads
- 2
- THT
- 22.1×7.0
- Boards
- 15
CP_Radial_D25.0mm_P10.00mm_SnapIn
Capacitor_THT
CP, Radial series, Radial, pin pitch=10.00mm, diameter=25mm, height=45mm, Electrolytic Capacitor, http://www.vishay.com/docs/28342/058059pll-si.pdf
- Pads
- 2
- THT
- 25.5×25.5
- Boards
- 15
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 15
QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 15
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 15
LQFP-48-1EP_7x7mm_P0.5mm_EP3.6x3.6mm
Package_QFP
LQFP, 48 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf)
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 15
SSOP-16_5.3x6.2mm_P0.65mm
Package_SO
SSOP, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14)
- Pads
- 16
- SMD
- 9.1×6.7
- Boards
- 15
TerminalBlock_Phoenix_PT-1,5-6-5.0-H_1x06_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-6-5.0-H, 6 pins, pitch 5mm, size 30x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf
- Pads
- 6
- THT
- 31.0×10.0
- Boards
- 15
C_Disc_D10.5mm_W5.0mm_P10.00mm
Capacitor_THT
C, Disc series, Radial, pin pitch=10.00mm, diameter*width=10.5*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf
- Pads
- 2
- THT
- 12.5×5.5
- Boards
- 14
Jack_3.5mm_CUI_SJ1-3523N_Horizontal
Connector_Audio
TRS 3.5mm, horizontal, through-hole, https://www.cuidevices.com/product/resource/pdf/sj1-352xn.pdf
- Pads
- 3
- THT
- 12.5×14.5
- Boards
- 14
Crystal_SMD_SeikoEpson_TSX3225-4Pin_3.2x2.5mm_HandSoldering
Crystal
Epson Toyocom TSX-3225, crystal, 3.2x2.5mm package, SMD, hand-soldering, http://www.mouser.com/ds/2/137/1721499-465440.pdf
- Pads
- 4
- SMD
- 5.5×4.4
- Boards
- 14
DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm
Package_DFN_QFN
DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)
- Pads
- 15
- SMD
- 4.0×3.6
- Boards
- 14
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 14
QFN-28-1EP_6x6mm_P0.65mm_EP4.8x4.8mm
Package_DFN_QFN
QFN, 28 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/440000001NCE/v_VBhk1IolDgxwwnOpcS_vTFxPfSEPQbuneK3mWsXlU page=125)
- Pads
- 29
- SMD
- 7.3×7.3
- Boards
- 14
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 14
SSOP-14_5.3x6.2mm_P0.65mm
Package_SO
SSOP, 14 Pin (JEDEC MO-150 variation AB, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150)
- Pads
- 14
- SMD
- 9.4×6.7
- Boards
- 14
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 14
R_Axial_Power_L25.0mm_W6.4mm_P27.94mm
Resistor_THT
Resistor, Axial_Power series, Box, pin pitch=27.94mm, 5W, length*width*height=25*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf
- Pads
- 2
- THT
- 30.8×6.9
- Boards
- 14
R_Box_L8.4mm_W2.5mm_P5.08mm
Resistor_THT
Resistor, Box series, Radial, pin pitch=5.08mm, 0.5W = 1/2W, length*width=8.38*2.54mm^2, http://www.vishay.com/docs/60051/cns020.pdf
- Pads
- 2
- THT
- 8.9×3.0
- Boards
- 14
C_Rect_L16.5mm_W6.0mm_P15.00mm_MKT
Capacitor_THT
C, Rect series, Radial, pin pitch=15.00mm, length*width=16.5*6mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf
- Pads
- 2
- THT
- 17.7×6.5
- Boards
- 13