Footprints

675 footprints matching “LEAD”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

675 footprints · page 11 of 29

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DIP-10_W7.62mm_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 10
THT: 10.5×13.2
Boards: 4

DIP-12_W7.62mm

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 12
THT: 9.7×15.7
Boards: 4

DIP-48_W15.24mm_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 48
THT: 18.1×61.5
Boards: 4

Vishay_HVM-DIP-3_W7.62mm

FP3D

Package_DIP

3-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf

Pads: 3
THT: 9.9×5.5
Boards: 4

Analog_LCC-8_5x5mm_P1.27mm

FP3D

Package_LCC

LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf

Pads: 8
SMD: 6.3×6.4
Boards: 4

SO-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

6-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads: 6
SMD: 8.8×4.1
Boards: 4

SOIC-8-N7_3.9x4.9mm_P1.27mm

FP3D

Package_SO

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)

Pads: 7
SMD: 7.5×5.4
Boards: 4

SSO-8_6.7x9.8mm_P2.54mm_Clearance8mm

FP3D

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf

Pads: 8
SMD: 11.9×10.3
Boards: 4

TSSOP-14-1EP_4.4x5mm_P0.65mm

FP3D

Package_SO

14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)

Pads: 15
SMD: 7.9×5.6
Boards: 4

WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.9×3.5
Boards: 4

TO-92_Inline_Horizontal1

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×10.1
Boards: 4

Fuse_BelFuse_0ZRE0055FF_L14.0mm_W4.1mm

FP3D

Fuse

Fuse 0ZRE0055FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf

Pads: 2
THT: 14.5×4.6
Boards: 3

DFN-S-8-1EP_6x5mm_P1.27mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 7.2×5.7
Boards: 3

MLF-6-1EP_1.6x1.6mm_P0.5mm_EP0.5x1.26mm

FP3D

Package_DFN_QFN

MLF, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf)

Pads: 7
SMD: 2.8×2.1
Boards: 3

QFN-16-1EP_5x5mm_P0.8mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf)

Pads: 17
SMD: 6.2×6.2
Boards: 3

QFN-20-1EP_3x4mm_P0.5mm_EP1.65x2.65mm

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf)

Pads: 21
SMD: 4.3×5.3
Boards: 3

QFN-24-1EP_3x4mm_P0.4mm_EP1.65x2.65mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf)

Pads: 25
SMD: 4.3×5.3
Boards: 3

QFN-24-1EP_5x5mm_P0.65mm_EP3.2x3.2mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/(UH24)%20QFN%2005-08-1747%20Rev%20A.pdf)

Pads: 25
SMD: 6.3×6.3
Boards: 3

QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)

Pads: 33
SMD: 5.2×5.2
Boards: 3

QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70)

Pads: 33
SMD: 5.2×5.2
Boards: 3