Vishay_HVM-DIP-3_W7.62mm

Package_DIP

3-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf

THT
DIP
DIL
PDIP
2.54mm
7.62mm
300mil
Vishay
HVMDIP
HEXDIP

Footprint

3 pads

Mount: Through hole
Courtyard: 9.92 × 5.5 mm
Pads: 3
File: 6 KB

3D model

STEP

Package_DIP_Vishay_HVM-DIP-3_W7.62mm

7.87 × 4.93 × 6.98 mm

171 KB STEP

Library: Package_DIP_Vishay_HVM-DIP-3
Model page: Open →

On real boards

The largest boards that carry it

Design	Parts	Nets	Layers	Board	Licence	Source
0.4	134	162	2	100 × 100 mm	CC-BY-4.0	SopaDeCogumelos/Hardware ↗
C2 MUST Autonics BOARD4	74	139	2	183 × 130 mm	CC-BY-4.0	MDU-C2/MUST-Autonics ↗
Callisto	34	86	2	99.06 × 97.66 mm	CC-BY-4.0	thekakkun/Callisto ↗
Callisto BOARD2	31	64	2	99.06 × 63.5 mm	CC-BY-4.0	thekakkun/Callisto ↗

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception