Footprints

377 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

377 footprints · page 11 of 16

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DFN-24-1EP_4x7mm_P0.5mm_EP2.64x6.44mm

FP3D

Package_DFN_QFN

DKD Package; 24-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_24_05-08-1864.pdf)

Pads: 25
SMD: 5.0×7.6
Boards: —

DFN-32-1EP_4x7mm_P0.4mm_EP2.64x6.44mm

FP3D

Package_DFN_QFN

DKD Package; 32-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_32_05-08-1734.pdf)

Pads: 33
SMD: 5.0×7.6
Boards: —

DFN-8-1EP_3x2mm_P0.45mm_EP1.66x1.36mm

FP3D

Package_DFN_QFN

DCB Package 8-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_8_05-08-1718.pdf)

Pads: 9
SMD: 4.0×2.6
Boards: —

Infineon_MLPQ-16-14-1EP_4x4mm_P0.5mm

FP3D

Package_DFN_QFN

MLPQ 32 leads, 7x7mm, 0.127mm stencil (https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134)

Pads: 15
SMD: 5.1×5.1
Boards: —

Texas_S-PWQFN-N20

FP3D

Package_DFN_QFN

20-Pin Plastic Quad Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf)

Pads: 20
SMD: 3.9×3.9
Boards: —

UQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 17
SMD: 5.3×5.3
Boards: —

DIP-10_W10.16mm

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 10
THT: 12.3×13.2
Boards: —

DIP-10_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 10
SMD: 10.7×13.3
Boards: —

DIP-10_W7.62mm_Socket_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 10
THT: 10.7×13.3
Boards: —

DIP-10_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 10
SMD: 12.5×13.3
Boards: —

DIP-18_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 18
SMD: 10.7×23.5
Boards: —

DIP-18_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

18-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 18
SMD: 12.5×23.5
Boards: —

DIP-20_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 20
SMD: 10.7×26.0
Boards: —

DIP-22_W10.16mm_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 22
THT: 13.1×28.4
Boards: —

DIP-22_W10.16mm_SMDSocket_SmallPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads

Pads: 22
SMD: 13.2×28.6
Boards: —

DIP-22_W10.16mm_Socket_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket, LongPads

Pads: 22
THT: 13.2×28.6
Boards: —

DIP-22_W11.43mm_SMDSocket_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 11.43mm (450 mils), SMDSocket, LongPads

Pads: 22
SMD: 15.0×28.6
Boards: —

DIP-22_W7.62mm

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 22
THT: 9.7×28.4
Boards: —

DIP-22_W7.62mm_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 22
THT: 10.5×28.4
Boards: —

DIP-22_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 22
SMD: 10.7×28.6
Boards: —

DIP-22_W7.62mm_Socket_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 22
THT: 10.7×28.6
Boards: —

DIP-22_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 22
SMD: 12.5×28.6
Boards: —

DIP-24_W10.16mm_SMDSocket_SmallPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads

Pads: 24
SMD: 13.2×31.1
Boards: —

DIP-24_W10.16mm_Socket

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket

Pads: 24
THT: 13.2×31.1
Boards: —