Footprints
675 footprints matching “lead”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFN-48-1EP_7x7mm_P0.5mm_EP5.1x5.1mm
Package_DFN_QFN
TQFN, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0144.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 3
WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm
Package_DFN_QFN
WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 3
DIP-12_W10.16mm
Package_DIP
12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 12
- THT
- 12.3×15.7
- Boards
- 3
DIP-12_W7.62mm_LongPads
Package_DIP
12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 12
- THT
- 10.5×15.7
- Boards
- 3
DIP-4_W10.16mm_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 4
- THT
- 13.1×5.6
- Boards
- 3
DIP-4_W7.62mm_Socket_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 4
- THT
- 10.7×5.7
- Boards
- 3
DIP-8-N7_W7.62mm
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7
- Pads
- 7
- THT
- 9.8×10.7
- Boards
- 3
PowerIntegrations_SMD-8
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 8
- SMD
- 11.1×10.7
- Boards
- 3
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
PowerIntegrations_SO-8C
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- 3
SSOP-18_4.4x6.5mm_P0.65mm
Package_SO
SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)
- Pads
- 18
- SMD
- 6.9×7.0
- Boards
- 3
Texas_S-PVSON-N8
Package_SON
8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf
- Pads
- 9
- SMD
- 4.2×3.6
- Boards
- 3
Texas_VSON-HR-8_1.5x2mm_P0.5mm
Package_SON
Texas VSON-HR, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62823.pdf#page=29)
- Pads
- 8
- SMD
- 2.8×2.5
- Boards
- 3
TO-92_Inline_W4.0mm_Horizontal_FlatSideDown
Package_TO_SOT_THT
TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 5.1×10.1
- Boards
- 3
L_CommonModeChoke_TDK_ACM2520-2P
Inductor_SMD
TDK common-mode choke, 4 Pin (https://product.tdk.com/system/files/dam/doc/product/emc/emc/cmf_cmc/catalog/cmf_commercial_signal_acm2520_en.pdf)
- Pads
- 4
- SMD
- 3.6×2.5
- Boards
- 2
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.35x2.35mm_ThermalVias
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_20.pdf, CP-16-20)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 2
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.5x1.5mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_27.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 2
LFCSP-20-1EP_4x4mm_P0.5mm_EP2.1x2.1mm
Package_CSP
LFCSP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_6.pdf)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- 2
LFCSP-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_CSP
LFCSP, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-6/cp_6_3.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 2
LFCSP-8-1EP_3x3mm_P0.5mm_EP1.45x1.74mm
Package_CSP
LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-8/CP_8_13.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 2
LFCSP-WD-10-1EP_3x3mm_P0.5mm_EP1.64x2.38mm
Package_CSP
LFCSP-WD, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 2
HVQFN-24-1EP_4x4mm_P0.5mm_EP2.1x2.1mm
Package_DFN_QFN
HVQFN, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-1.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 2
QFN-28-1EP_3x6mm_P0.5mm_EP1.7x4.75mm
Package_DFN_QFN
QFN, 28 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081926_0_UDE28.pdf)
- Pads
- 29
- SMD
- 4.3×7.3
- Boards
- 2