Footprints

354 footprints matching “pads”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

354 footprints · page 12 of 15

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DIP-64_W15.24mm_Socket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 64
THT: 18.3×81.9
Boards: —

DIP-64_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 64
SMD: 20.1×81.9
Boards: —

DIP-64_W22.86mm_SMDSocket_SmallPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), SMDSocket, SmallPads

Pads: 64
SMD: 25.9×81.9
Boards: —

DIP-64_W24.13mm_SMDSocket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 24.13mm (950 mils), SMDSocket, LongPads

Pads: 64
SMD: 27.7×81.9
Boards: —

DIP-64_W25.4mm_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), LongPads

Pads: 64
THT: 28.3×81.8
Boards: —

DIP-64_W25.4mm_SMDSocket_SmallPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), SMDSocket, SmallPads

Pads: 64
SMD: 28.4×81.9
Boards: —

DIP-64_W26.67mm_SMDSocket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 26.67mm (1050 mils), SMDSocket, LongPads

Pads: 64
SMD: 30.3×81.9
Boards: —

PowerIntegrations_PDIP-8B

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_PDIP-8C

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_SDIP-10C

FP3D

Package_DIP

PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf

Pads: 9
THT: 10.6×13.3
Boards: —

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: —

TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)

Pads: 49
SMD: 10.3×10.3
Boards: —

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm

FP3D

Package_QFP

TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)

Pads: 81
SMD: 17.4×17.4
Boards: —

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias

FP3D

Package_QFP

Pads: 81
SMD: 17.4×17.4
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads: 21
SMD: 7.9×7.1
Boards: —

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: —

TO-92_Inline_Horizontal2

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×10.1
Boards: —

TO-92_Inline_W4.0mm_Horizontal_FlatSideUp

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×10.1
Boards: —

TO-92-2_W4.0mm_Horizontal_FlatSideDown

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 2
THT: 5.1×10.1
Boards: —

TO-92-2_W4.0mm_Horizontal_FlatSideUp

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 2
THT: 5.1×10.1
Boards: —

R_1218_3246Metric_Pad1.22x4.75mm_HandSolder

FP3D

Resistor_SMD

Resistor SMD 1218 (3246 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20035/dcrcwe3.pdf)

Pads: 2
SMD: 4.9×5.3
Boards: —

Altech_AK300_1x05_P5.00mm_45-Degree

FP3D

TerminalBlock_Altech

Terminal block Altech AK300, 45Degree (cable under 45degree), 5 pins, pitch 5mm, size 25x12.5mm, drill diameter 1.3mm, pad diameter 3mm, https://www.altechcorp.com/PDFS/PCBMETRC.PDF#page=5

Pads: 5
THT: 26.0×13.5
Boards: —

Altech_AK300_1x09_P5.00mm_45-Degree

FP3D

TerminalBlock_Altech

Terminal block Altech AK300, 45Degree (cable under 45degree), 9 pins, pitch 5mm, size 45x12.5mm, drill diameter 1.3mm, pad diameter 3mm, https://www.altechcorp.com/PDFS/PCBMETRC.PDF#page=5

Pads: 9
THT: 46.0×13.5
Boards: —

Altech_AK300_1x10_P5.00mm_45-Degree

FP3D

TerminalBlock_Altech

Terminal block Altech AK300, 45Degree (cable under 45degree), 10 pins, pitch 5mm, size 50x12.5mm, drill diameter 1.3mm, pad diameter 3mm, https://www.altechcorp.com/PDFS/PCBMETRC.PDF#page=5

Pads: 10
THT: 51.0×13.5
Boards: —