Footprints
675 footprints matching “LEAD”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm_ThermalVias
Package_DFN_QFN
QFN, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf)
- Pads
- 37
- SMD
- 7.2×7.2
- Boards
- 2
QFN-44-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias
Package_DFN_QFN
QFN, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 2
QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm
Package_DFN_QFN
QFN, 56 Pin (http://www.ti.com/lit/an/scea032/scea032.pdf#page=4)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- 2
QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm
Package_DFN_QFN
QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)
- Pads
- 65
- SMD
- 9.2×9.2
- Boards
- 2
QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm
Package_DFN_QFN
64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- 2
QFN-76-1EP_9x9mm_P0.4mm_EP5.81x6.31mm
Package_DFN_QFN
QFN, 76 Pin (https://ftdichip.com/wp-content/uploads/2020/07/DS_FT600Q-FT601Q-IC-Datasheet.pdf#page=27)
- Pads
- 77
- SMD
- 10.3×10.3
- Boards
- 2
Texas_RGP0020H_VQFN-20-1EP_4x4mm_P0.5mm_EP2.4x2.4mm
Package_DFN_QFN
Texas RGP0020H VQFN, 20 Pin (http://www.ti.com/lit/ds/symlink/cc1101.pdf#page=101)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- 2
UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm
Package_DFN_QFN
16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 2
UQFN-40-1EP_5x5mm_P0.4mm_EP3.8x3.8mm
Package_DFN_QFN
UQFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=345)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 2
WDFN-8-1EP_6x5mm_P1.27mm_EP3.4x4mm
Package_DFN_QFN
WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf)
- Pads
- 9
- SMD
- 7.2×5.5
- Boards
- 2
DIP-14_W10.16mm_LongPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 14
- THT
- 13.1×18.3
- Boards
- 2
DIP-14_W8.89mm_SMDSocket_LongPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 14
- SMD
- 12.5×18.4
- Boards
- 2
DIP-24_W10.16mm_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 24
- THT
- 13.1×31.0
- Boards
- 2
DIP-28_W7.62mm_SMDSocket_SmallPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 28
- SMD
- 10.7×36.2
- Boards
- 2
DIP-64_W22.86mm_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), LongPads
- Pads
- 64
- THT
- 25.8×81.8
- Boards
- 2
DIP-64_W25.4mm
Package_DIP
64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils)
- Pads
- 64
- THT
- 27.5×81.8
- Boards
- 2
DIP-64_W25.4mm_Socket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket, LongPads
- Pads
- 64
- THT
- 28.4×81.9
- Boards
- 2
PowerIntegrations_SMD-8B
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- 2
SMDIP-8_W11.48mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 8
- SMD
- 14.0×10.7
- Boards
- 2
SMDIP-8_W9.53mm_Clearance8mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 8
- SMD
- 11.5×10.7
- Boards
- 2
VLGA-4_2x2.5mm_P1.65mm
Package_LGA
VLGA, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf#page=15)
- Pads
- 4
- SMD
- 2.5×3.0
- Boards
- 2
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 2
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
SSO-6_6.8x4.6mm_P1.27mm_Clearance7mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 11.2×5.1
- Boards
- 2