HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

SSOP
0.65
PowerPAD

Footprint

33 pads

Mount: Surface mount
Courtyard: 9 × 11.6 mm
Pads: 33
File: 10 KB

3D model

STEP

Package_SO_HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm

8.30 × 11 × 1.60 mm

414 KB STEP

Library: Package_SO_HTSSOP-32-1EP_6.1x11mm_P0.65mm
Model page: Open →

On real boards

The largest boards that carry it

Design	Parts	Nets	Layers	Board	Licence	Source
Lab Nvm BOARD5	228	255	2	151 × 131 mm	CC-BY-4.0	xuan-lab/nvm ↗
Teensy Audio Fx	82	90	4	60 × 100 mm	CC-BY-4.0	mattvenn/teensy-audio-fx ↗

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception