Footprints
675 footprints matching “LEAD”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm_ThermalVias
Package_DFN_QFN
QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 1
QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm_ThermalVias
Package_DFN_QFN
QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)
- Pads
- 65
- SMD
- 9.2×9.2
- Boards
- 1
QFN-64-1EP_9x9mm_P0.5mm_EP4.1x4.1mm
Package_DFN_QFN
QFN, 64 Pin (https://www.silabs.com/documents/public/data-sheets/cp2108-datasheet.pdf)
- Pads
- 65
- SMD
- 10.2×10.2
- Boards
- 1
Texas_RGE0024C_VQFN-24-1EP_4x4mm_P0.5mm_EP2.1x2.1mm_ThermalVias
Package_DFN_QFN
Texas RGE0024C VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 1
Texas_RGE0024H_VQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
Texas RGE0024H VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=40)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 1
Texas_RGY_R-PVQFN-N20_EP2.05x3.05mm
Package_DFN_QFN
QFN, 20 Pin, RGY0020A (https://www.ti.com/lit/ds/symlink/txb0108.pdf#page=33)
- Pads
- 21
- SMD
- 4.4×5.4
- Boards
- 1
Texas_RGZ0048A_VQFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
Package_DFN_QFN
Texas RGZ0048A VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/msp430f5232.pdf#page=113)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 1
Texas_RGZ0048A_VQFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias
Package_DFN_QFN
Texas RGZ0048A VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/msp430f5232.pdf#page=113)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 1
Texas_RTW_WQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
Texas RTW WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 1
TQFN-20-1EP_5x5mm_P0.65mm_EP3.1x3.1mm
Package_DFN_QFN
TQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3))
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- 1
TQFN-44-1EP_7x7mm_P0.5mm_EP4.7x4.7mm
Package_DFN_QFN
TQFN, 44 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0144.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 1
UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm_ThermalVias
Package_DFN_QFN
UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)
- Pads
- 21
- SMD
- 4.2×4.2
- Boards
- 1
UQFN-48-1EP_6x6mm_P0.4mm_EP4.45x4.45mm
Package_DFN_QFN
UQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- 1
VDFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.7mm
Package_DFN_QFN
8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 3.2×2.6
- Boards
- 1
VQFN-12-1EP_4x4mm_P0.8mm_EP2.1x2.1mm_ThermalVias
Package_DFN_QFN
VQFN, 12 Pin (https://www.mouser.ch/datasheet/2/268/EMC2301_2_3_5_Data_Sheet_DS20006532A-3443118.pdf)
- Pads
- 13
- SMD
- 5.2×5.2
- Boards
- 1
W-PDFN-8-1EP_6x5mm_P1.27mm_EP3x3mm
Package_DFN_QFN
W-PDFN, 8 Pin (https://www.mouser.com/datasheet/2/671/mt25q_qljs_u_256_aba_0-3178731.pdf#page=22)
- Pads
- 9
- SMD
- 7.3×5.5
- Boards
- 1
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- 1
DIP-10_W10.16mm_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 10
- THT
- 13.1×13.2
- Boards
- 1
DIP-10_W7.62mm_Socket
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 10
- THT
- 10.7×13.3
- Boards
- 1
DIP-12_W10.16mm_LongPads
Package_DIP
12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 12
- THT
- 13.1×15.7
- Boards
- 1
DIP-12_W7.62mm_SMDSocket_SmallPads
Package_DIP
12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 12
- SMD
- 10.7×15.9
- Boards
- 1
DIP-12_W7.62mm_Socket
Package_DIP
12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 12
- THT
- 10.7×15.9
- Boards
- 1
DIP-12_W7.62mm_Socket_LongPads
Package_DIP
12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 12
- THT
- 10.7×15.9
- Boards
- 1
DIP-12_W8.89mm_SMDSocket_LongPads
Package_DIP
12-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 12
- SMD
- 12.5×15.9
- Boards
- 1
