Footprints

4,101 footprints matching “G”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

4,101 footprints · page 166 of 171

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DIP-24_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 24
SMD: 12.5×31.1
Boards: —

DIP-32_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 32
SMD: 20.1×41.3
Boards: —

DIP-40_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 40
SMD: 20.1×51.4
Boards: —

DIP-40_W26.67mm_SMDSocket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 26.67mm (1050 mils), SMDSocket, LongPads

Pads: 40
SMD: 30.3×51.4
Boards: —

DIP-42_W15.24mm_LongPads

FP3D

Package_DIP

42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 42
THT: 18.1×53.9
Boards: —

DIP-42_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

42-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 42
SMD: 20.1×54.0
Boards: —

DIP-48_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 48
SMD: 20.1×61.6
Boards: —

DIP-5-6_W10.16mm_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads

Pads: 5
THT: 13.2×8.2
Boards: —

DIP-5-6_W7.62mm_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads

Pads: 5
THT: 10.6×8.2
Boards: —

DIP-5-6_W7.62mm_Socket_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads

Pads: 5
THT: 10.7×8.3
Boards: —

DIP-5-6_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads

Pads: 5
SMD: 12.5×8.3
Boards: —

DIP-6_W10.16mm_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 6
THT: 13.1×8.1
Boards: —

DIP-64_W15.24mm_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 64
THT: 18.1×81.8
Boards: —

DIP-64_W15.24mm_Socket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 64
THT: 18.3×81.9
Boards: —

DIP-64_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 64
SMD: 20.1×81.9
Boards: —

DIP-64_W24.13mm_SMDSocket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 24.13mm (950 mils), SMDSocket, LongPads

Pads: 64
SMD: 27.7×81.9
Boards: —

DIP-64_W25.4mm_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), LongPads

Pads: 64
THT: 28.3×81.8
Boards: —

DIP-64_W26.67mm_SMDSocket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 26.67mm (1050 mils), SMDSocket, LongPads

Pads: 64
SMD: 30.3×81.9
Boards: —

PowerIntegrations_eDIP-12B

FP3D

Package_DIP

Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf

Pads: 11
THT: 12.1×10.8
Boards: —

PowerIntegrations_PDIP-8B

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_PDIP-8C

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_SDIP-10C

FP3D

Package_DIP

PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf

Pads: 9
THT: 10.6×13.3
Boards: —

PowerIntegrations_SMD-8C

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
SMD: 11.1×10.7
Boards: —

AMS_LGA-20_4.7x4.5mm_P0.65mm

FP3D

Package_LGA

http://ams.com/eng/content/download/1008631/2361759/498838

Pads: 20
SMD: 6.0×6.2
Boards: —