Footprints

5,896 footprints matching “2”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

5,896 footprints · page 18 of 246

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Crystal_SMD_SeikoEpson_FA238-4Pin_3.2x2.5mm

FP3D

Crystal

Epson Toyocom FA-238, crystal, 3.2x2.5mm package, SMD, http://www.mouser.com/ds/2/137/1721499-465440.pdf

Pads: 4
SMD: 4.2×3.5
Boards: 56

LGA-28_5.2x3.8mm_P0.5mm

FP3D

Package_LGA

LGA 28 5.2x3.8mm Pitch 0.5mm

Pads: 28
SMD: 6.0×4.5
Boards: 56

Aosong_DHT11_5.5x12.0_P2.54mm

FP3D

Sensor

Temperature and humidity module, http://akizukidenshi.com/download/ds/aosong/DHT11.pdf

Pads: 4
THT: 6.0×12.5
Boards: 56

DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 55

LGA-8_3x5mm_P1.25mm

FP3D

Package_LGA

LGA-8

Pads: 8
SMD: 3.6×5.5
Boards: 55

TSOP-II-54_22.2x10.16mm_P0.8mm

FP3D

Package_SO

54-lead TSOP typ II package

Pads: 54
SMD: 13.5×22.7
Boards: 55

TerminalBlock_Phoenix_MKDS-1,5-4_1x04_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-4, 4 pins, pitch 5mm, size 20x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 4
THT: 21.0×10.8
Boards: 55

SW_Slide_SPDT_Angled_CK_OS102011MA1Q

FP3D

Button_Switch_THT

CuK miniature slide switch, OS series, SPDT, right angle, http://www.ckswitches.com/media/1428/os.pdf

Pads: 3
THT: 11.4×9.4
Boards: 54

PinHeader_1x05_P1.27mm_Vertical

FP3D

Connector_PinHeader_1.27mm

Through hole straight pin header, 1x05, 1.27mm pitch, single row

Pads: 5
THT: 3.1×7.4
Boards: 54

PinHeader_1x17_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 1x17, 2.54mm pitch, single row

Pads: 17
THT: 3.5×44.2
Boards: 54

SSOP-20_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)

Pads: 20
SMD: 6.9×9.3
Boards: 54

R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0204 series, Axial, Vertical, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads: 2
THT: 7.1×2.1
Boards: 54

TerminalBlock_Phoenix_MKDS-1,5-3_1x03_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-3, 3 pins, pitch 5mm, size 15x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 3
THT: 16.0×10.8
Boards: 54

SW_DIP_SPSTx02_Slide_9.78x7.26mm_W7.62mm_P2.54mm

FP3D

Button_Switch_THT

2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. https://www.ctscorp.com/wp-content/uploads/206-208.pdf)

Pads: 4
THT: 10.3×7.9
Boards: 53

CP_Radial_D13.0mm_P5.00mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=5.00mm, diameter=13mm, height=20mm, Electrolytic Capacitor

Pads: 2
THT: 13.5×13.5
Boards: 53

IDC-Header_2x07_P2.54mm_Vertical

FP3D

Connector_IDC

Through hole IDC box header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0

Pads: 14
THT: 9.9×26.4
Boards: 53