Footprints
496 footprints matching “16”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Broadcom_AFBR-16xxZ_Tilted
OptoDevice
Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN
- Pads
- 6
- THT
- 19.8×12.8
- Boards
- —
Analog_BGA-165_11.9x16mm_Layout11x15_P1.0mm
Package_BGA
Analog BGA-165 (Reference LTC DWG#05-08-1605 Rev B), 11.9x16.0mm, 165 Ball, 11x15 Layout, 1.0mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081605_b_bga165.pdf
- Pads
- 165
- SMD
- 13.9×18.0
- Boards
- —
Analog_BGA-209_9.5x16mm_Layout11x19_P0.8mm
Package_BGA
Analog BGA-209 (Reference LTC DWG#05-08-1561 Rev B), 9.5x16.0mm, 209 Ball, 11x19 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081561_bga209.pdf
- Pads
- 209
- SMD
- 11.5×18.0
- Boards
- —
FCPBGA-780_23x23mm_Layout28x28_P0.8mm
Package_BGA
FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf
- Pads
- 780
- SMD
- 25.0×25.0
- Boards
- —
NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm
Package_BGA
NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf
- Pads
- 59
- SMD
- 6.0×6.0
- Boards
- —
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_23.pdf, CP-16-23)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm_ThermalVias
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_23.pdf, CP-16-23)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.35x2.35mm
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_20.pdf, CP-16-20)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
LFCSP-16_3x3mm_P0.5mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_32.pdf)
- Pads
- 16
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
LFCSP-16-1EP_4x4mm_P0.65mm_EP2.6x2.6mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_17.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
LFCSP-16-1EP_4x4mm_P0.65mm_EP2.6x2.6mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_17.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
DFN-16-1EP_3x5mm_P0.5mm_EP1.66x4.4mm
Package_DFN_QFN
DHC Package; 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf)
- Pads
- 17
- SMD
- 4.0×5.6
- Boards
- —
DFN-16-1EP_5x5mm_P0.5mm_EP3.46x4mm
Package_DFN_QFN
DH Package; 16-Lead Plastic DFN (5mm x 5mm) (see Linear Technology DFN_16_05-08-1709.pdf)
- Pads
- 17
- SMD
- 6.0×5.6
- Boards
- —
HXQFN-16-1EP_3x3mm_P0.5mm_EP1.85x1.85mm
Package_DFN_QFN
HXQFN, 16 Pin (https://www.nxp.com/docs/en/data-sheet/NX3L4051.pdf#page=17)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
HXQFN-16-1EP_3x3mm_P0.5mm_EP1.85x1.85mm_ThermalVias
Package_DFN_QFN
HXQFN, 16 Pin (https://www.nxp.com/docs/en/data-sheet/NX3L4051.pdf#page=17)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
Infineon_MLPQ-16-14-1EP_4x4mm_P0.5mm
Package_DFN_QFN
MLPQ 32 leads, 7x7mm, 0.127mm stencil (https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134)
- Pads
- 15
- SMD
- 5.1×5.1
- Boards
- —
MPS_QFN-16_3x3mm_P0.5mm
Package_DFN_QFN
MPS QFN, 16 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP8859/document_id/4033/)
- Pads
- 16
- SMD
- 4.3×4.3
- Boards
- —
QFN-16-1EP_5x5mm_P0.8mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf)
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- —
UQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm
Package_DFN_QFN
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
DIP-10_W10.16mm
Package_DIP
10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 10
- THT
- 12.3×13.2
- Boards
- —
DIP-22_W10.16mm_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 22
- THT
- 13.1×28.4
- Boards
- —