Footprints

411 footprints matching “11”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

411 footprints · page 2 of 18

Matched by name and keywords. Search by meaning instead

CP_Elec_8x11.9

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic, Panasonic E12, 8.0x11.9mm

Pads
2
SMD
11.6×8.8
Boards
19

CP_Axial_L11.0mm_D6.0mm_P18.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=18mm, length*diameter=11*6mm^2, Electrolytic Capacitor

Pads
2
THT
20.9×6.5
Boards
19

VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias

FP3D

Package_SON

VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument

Pads
11
SMD
4.3×4.3
Boards
17

R_Axial_DIN0414_L11.9mm_D4.5mm_P20.32mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0414 series, Axial, Horizontal, pin pitch=20.32mm, 2W, length*diameter=11.9*4.5mm^2, http://www.vishay.com/docs/20128/wkxwrx.pdf

Pads
2
THT
23.2×5.0
Boards
17

CP_Axial_L11.0mm_D5.0mm_P18.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=18mm, length*diameter=11*5mm^2, Electrolytic Capacitor

Pads
2
THT
20.9×5.5
Boards
16

VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm

FP3D

Package_SON

VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument

Pads
11
SMD
4.3×4.3
Boards
14

R_Axial_DIN0411_L9.9mm_D3.6mm_P5.08mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0411 series, Axial, Vertical, pin pitch=5.08mm, 1W, length*diameter=9.9*3.6mm^2

Pads
2
THT
8.6×4.1
Boards
14

Buzzer_Mallory_AST1109MLTRQ

FP3D

Buzzer_Beeper

Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf

Pads
2
SMD
15.9×9.5
Boards
13

PinSocket_2x11_P2.54mm_Vertical

FP3D

Connector_PinSocket_2.54mm

Through hole straight socket strip, 2x11, 2.54mm pitch, double rows (from Kicad 4.0.7), script generated

Pads
22
THT
6.1×28.9
Boards
13

R_Array_SIP11

FP3D

Resistor_THT

11-pin Resistor SIP pack

Pads
11
THT
28.6×3.1
Boards
13

BatteryHolder_Eagle_12BH611-GR

FP3D

Battery

https://eu.mouser.com/datasheet/2/209/EPD-200766-1274481.pdf

Pads
2
THT
55.5×31.2
Boards
12

SW_DIP_SPSTx01_Slide_Omron_A6S-110x_W8.9mm_P2.54mm

FP3D

Button_Switch_SMD

SMD 1x-dip-switch SPST Omron_A6S-110x, Slide, row spacing 8.9 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf)

Pads
2
SMD
10.9×4.1
Boards
12

SMA_Amphenol_132134-11_Vertical

FP3D

Connector_Coaxial

https://www.amphenolrf.com/library/download/link/link_id/596215/parent/132134-11/

Pads
2
THT
8.3×8.3
Boards
12

R_Axial_DIN0411_L9.9mm_D3.6mm_P20.32mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0411 series, Axial, Horizontal, pin pitch=20.32mm, 1W, length*diameter=9.9*3.6mm^2

Pads
2
THT
23.2×4.1
Boards
11

R_Axial_DIN0414_L11.9mm_D4.5mm_P5.08mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0414 series, Axial, Vertical, pin pitch=5.08mm, 2W, length*diameter=11.9*4.5mm^2, http://www.vishay.com/docs/20128/wkxwrx.pdf

Pads
2
THT
9.0×5.0
Boards
11

R_Axial_DIN0414_L11.9mm_D4.5mm_P7.62mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0414 series, Axial, Vertical, pin pitch=7.62mm, 2W, length*diameter=11.9*4.5mm^2, http://www.vishay.com/docs/20128/wkxwrx.pdf

Pads
2
THT
11.6×5.0
Boards
11

D_2114_3652Metric_Pad1.85x3.75mm_HandSolder

FP3D

Diode_SMD

Diode SMD 2114 (3652 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/schottky.pdf)

Pads
2
SMD
6.9×4.3
Boards
10

L_Axial_L11.0mm_D4.5mm_P15.24mm_Horizontal_Fastron_MECC

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=15.24mm, length*diameter=11*4.5mm^2, Fastron, MECC, http://www.fastrongroup.com/image-show/21/MECC.pdf?type=Complete-DataSheet&productType=series

Pads
2
THT
17.8×5.0
Boards
9

BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD

FP3D

Package_BGA

121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)

Pads
121
SMD
11.0×11.0
Boards
9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads
33
SMD
9.0×11.6
Boards
9

PinHeader_1x11_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x11, 2.54mm pitch, 6mm pin length, single row

Pads
11
THT
12.3×28.9
Boards
8

SW_DIP_SPSTx04_Piano_10.8x11.72mm_W7.62mm_P2.54mm

FP3D

Button_Switch_THT

4x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm

Pads
8
THT
13.1×12.3
Boards
7

C_Disc_D11.0mm_W5.0mm_P10.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=10.00mm, diameter*width=11*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf

Pads
2
THT
12.5×5.5
Boards
7

C_Disc_D11.0mm_W5.0mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=11*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf

Pads
2
THT
11.5×5.5
Boards
7