Footprints

41 footprints matching “Array

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

41 footprints · page 2 of 2

Matched by name and keywords. Search by meaning instead

R_Array_SIP12

FP3D

Resistor_THT

12-pin Resistor SIP pack

Pads
12
THT
31.1×3.1
Boards
6

R_Array_Concave_2x0603

FP3D

Resistor_SMD

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf)

Pads
4
SMD
3.1×2.1
Boards
4

R_Array_Convex_5x0603

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR15 (see mnr_g.pdf)

Pads
10
SMD
3.1×3.9
Boards
4

Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads
8
SMD
2.9×3.9
Boards
3

R_Array_Convex_5x1206

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR35 (see mnr_g.pdf)

Pads
10
SMD
4.4×6.9
Boards
3

HDSP-4832

FP3D

Display

10-Element Red Yellow Green Bar Graph Array https://docs.broadcom.com/docs/AV02-1798EN

Pads
20
THT
10.7×25.9
Boards
2

HDSP-4840

FP3D

Display

10-Element Yellow Bar Graph Array https://docs.broadcom.com/docs/AV02-1798EN

Pads
20
THT
10.7×25.9
Boards
2

HLCP-J100

FP3D

Display

10-Element Red Bar Graph Array https://docs.broadcom.com/docs/AV02-1798EN

Pads
20
THT
10.7×25.9
Boards
2

R_Array_SIP13

FP3D

Resistor_THT

13-pin Resistor SIP pack

Pads
13
THT
33.7×3.1
Boards
2

HDSP-4836

FP3D

Display

10-Element Red Yellow Green Bar Graph Array https://docs.broadcom.com/docs/AV02-1798EN

Pads
20
THT
10.7×25.9
Boards
1

HDSP-48xx

FP3D

Display

10-Element Bar Graph Array https://docs.broadcom.com/docs/AV02-1798EN

Pads
20
THT
10.7×25.9
Boards
1

AMS_LGA-10-1EP_2.7x4mm_P0.6mm

FP3D

Package_LGA

LGA-10, http://ams.com/eng/content/download/951091/2269479/471718

Pads
11
SMD
3.0×4.3
Boards
1

R_Array_Convex_2x1206

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR32 (see mnr_g.pdf)

Pads
4
SMD
4.4×3.1
Boards
1

R_Array_SIP14

FP3D

Resistor_THT

14-pin Resistor SIP pack

Pads
14
THT
36.2×3.1
Boards
1

L_Array_Concave_4x0402

FP3D

muratovas-MAS_Package_std

Chip Common Mode Choke Coil Arrays

Pads
8
SMD
2.0×2.5
Boards

LGA-12_2x2mm_P0.5mm

FP3D

muratovas-MAS_Package_std

LGA12

Pads
12
SMD
2.5×2.5
Boards

Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf

Pads
12
SMD
4.1×3.6
Boards