Footprints
78 footprints matching “Small,”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIP-14_W7.62mm_SMDSocket_SmallPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 14
- SMD
- 10.7×18.4
- Boards
- 5
SO-4_4.4x2.3mm_P1.27mm
Package_SO
4-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf
- Pads
- 4
- SMD
- 8.8×2.9
- Boards
- 5
SSOP-56_7.5x18.5mm_P0.635mm
Package_SO
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)
- Pads
- 56
- SMD
- 11.1×19.1
- Boards
- 5
SO-6_4.4x3.6mm_P1.27mm
Package_SO
6-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 8.8×4.1
- Boards
- 4
SO-6L_10x3.84mm_P1.27mm
Package_SO
6-pin plasic small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770
- Pads
- 6
- SMD
- 11.3×4.3
- Boards
- 4
SOIC-8-N7_3.9x4.9mm_P1.27mm
Package_SO
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)
- Pads
- 7
- SMD
- 7.5×5.4
- Boards
- 4
SSO-8_6.7x9.8mm_P2.54mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf
- Pads
- 8
- SMD
- 11.9×10.3
- Boards
- 4
TSSOP-14-1EP_4.4x5mm_P0.65mm
Package_SO
14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)
- Pads
- 15
- SMD
- 7.9×5.6
- Boards
- 4
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
PowerIntegrations_SO-8C
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- 3
SSOP-18_4.4x6.5mm_P0.65mm
Package_SO
SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)
- Pads
- 18
- SMD
- 6.9×7.0
- Boards
- 3
SW_SPST_B3U-1100P
Button_Switch_SMD
Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, without Boss
- Pads
- 3
- SMD
- 4.8×4.1
- Boards
- 2
SW_SPST_B3U-1100P-B
Button_Switch_SMD
Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, with Boss
- Pads
- 3
- SMD
- 4.8×4.1
- Boards
- 2
SW_SPST_B3U-3100P-B
Button_Switch_SMD
Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, with Boss
- Pads
- 3
- SMD
- 4.8×4.8
- Boards
- 2
DIP-28_W7.62mm_SMDSocket_SmallPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 28
- SMD
- 10.7×36.2
- Boards
- 2
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 2
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
SSO-6_6.8x4.6mm_P1.27mm_Clearance7mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 11.2×5.1
- Boards
- 2
SSOP-44_5.3x12.8mm_P0.5mm
Package_SO
44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf)
- Pads
- 44
- SMD
- 8.5×13.3
- Boards
- 2
Texas_PWP0020A
Package_SO
20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)
- Pads
- 21
- SMD
- 8.2×7.0
- Boards
- 2
TSSOP-44_4.4x11.2mm_P0.5mm
Package_SO
TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)
- Pads
- 44
- SMD
- 7.4×11.9
- Boards
- 2
SW_SPST_B3U-3100P
Button_Switch_SMD
Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, without Boss
- Pads
- 3
- SMD
- 4.8×4.8
- Boards
- 1
DIP-12_W7.62mm_SMDSocket_SmallPads
Package_DIP
12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 12
- SMD
- 10.7×15.9
- Boards
- 1
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_ThermalVias
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 1