Footprints

39 footprints matching “XP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

39 footprints · page 2 of 2

Matched by name and keywords. Search by meaning instead

Converter_DCDC_XP_POWER-IHxxxxSH_THT

FP3D

Converter_DCDC

DCDC-Converter, XP Power, IH series, 2W, ≥3000V isolation, SIP-7, https://www.xppower.com/portals/0/pdfs/SF_IH.pdf

Pads: 5
THT: 9.1×21.0
Boards: —

Converter_DCDC_XP_POWER-ISU02_SMD

FP3D

Converter_DCDC

DCDC-Converter, XP POWER, ISU02 Series, 2W Single and Dual Output, 1500VDC Isolation, 19.0x17.0x8.7mm https://www.xppower.com/Portals/0/pdfs/SF_ISU02.pdf

Pads: 7
SMD: 19.1×19.5
Boards: —

Converter_DCDC_XP_POWER-ITQxxxxS-H_THT

FP3D

Converter_DCDC

DCDC-Converter, XP Power, ITQ series, 6W, 1500V isolation, SIP-8, https://www.xppower.com/portals/0/pdfs/SF_ITQ.pdf

Pads: 6
THT: 11.7×24.4
Boards: —

Converter_DCDC_XP_POWER-ITXxxxxSA_THT

FP3D

Converter_DCDC

DCDC-Converter, XP Power, ITX series, single-output, 6W, 1500V isolation, SIP-8, https://www.xppower.com/portals/0/pdfs/SF_ITX.pdf

Pads: 5
THT: 11.7×24.4
Boards: —

FCPBGA-780_23x23mm_Layout28x28_P0.8mm

FP3D

Package_BGA

FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf

Pads: 780
SMD: 25.0×25.0
Boards: —

NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm

FP3D

Package_BGA

NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf

Pads: 98
SMD: 9.0×9.0
Boards: —

NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

FP3D

Package_BGA

NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf

Pads: 59
SMD: 6.0×6.0
Boards: —

NXP_VFBGA-42_2.6x3mm_Layout6x7_P0.4mm

FP3D

Package_BGA

NXP VFBGA-42, 2.6x3.0mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf

Pads: 42
SMD: 4.6×5.0
Boards: —

NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm

FP3D

Package_CSP

NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf

Pads: 49
SMD: 5.4×5.4
Boards: —

NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm

FP3D

Package_CSP

NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf

Pads: 100
SMD: 7.1×7.1
Boards: —

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm_ThermalVias

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

TQFP-80_14x14mm_P0.65mm

FP3D

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)

Pads: 80
SMD: 17.3×17.3
Boards: —