Footprints
53 footprints matching “micro”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SW_XKB_DM1-16UP-1
Button_Switch_THT
1A 30V SPDT Micro Switch rated for one million cycles, W12.7xD5.7xH6.6, https://www.helloxkb.com/public/images/pdf/DMX-XXXP-X.pdf
- Pads
- 3
- THT
- 18.0×6.4
- Boards
- 2
Crystal_SMD_MicroCrystal_CC4V-T1A-2Pin_5.0x1.9mm_HandSoldering
Crystal
MicroCrystal CC4V-T1A, Crystal, 5.0x1.9mm package, SMD, hand-soldering, http://cdn-reichelt.de/documents/datenblatt/B400/CC4V-T1A.pdf
- Pads
- 2
- SMD
- 8.0×2.9
- Boards
- 2
MagneticBuzzer_StarMicronics_HMB-06_HMB-12
Buzzer_Beeper
Buzzer, Elektromagnetic Beeper, Summer,
- Pads
- 2
- THT
- 17.0×17.0
- Boards
- 1
Crystal_SMD_MicroCrystal_CC5V-T1A-2Pin_4.1x1.5mm_HandSoldering
Crystal
MicroCrystal CC5V-T1A, Crystal, 4.1x1.5mm package, SMD, hand-soldering, http://cdn-reichelt.de/documents/datenblatt/B400/CC5V-T1A.pdf
- Pads
- 2
- SMD
- 6.7×2.5
- Boards
- 1
Diode_Bridge_Diotec_MicroDil_3.0x3.0x1.8mm
Diode_SMD
SMD package Diotec Diotec MicroDil, body 3.0x3.0x1.8mm (e.g. diode bridge), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/mys40.pdf
- Pads
- 4
- SMD
- 6.1×3.5
- Boards
- 1
OnSemi_Micro8
Package_SO
ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF
- Pads
- 8
- SMD
- 5.8×3.6
- Boards
- 1
QFN-24-EP-MICROCHIP
agg-agg
- Pads
- 25
- SMD
- 5.0×5.0
- Boards
- —
QFN-36-EP-MICROCHIP-SQFN
agg-agg
- Pads
- 37
- SMD
- 7.0×7.0
- Boards
- —
SW_XKB_DM1-16UD-1
Button_Switch_THT
1A 30V SPDT Micro Switch rated for one million cycles, W12.7xD5.7xH6.6, https://www.helloxkb.com/public/images/pdf/DMX-XXXD-X.pdf
- Pads
- 3
- THT
- 18.0×17.0
- Boards
- —
HDMI_Micro-D_Molex_46765-0xxx
Connector_Video
HDMI, Micro, Type D, SMD, 0.4mm pitch, 19 ckt, right angle (http://www.molex.com/pdm_docs/sd/467651301_sd.pdf)
- Pads
- 20
- SMD
- 8.6×8.6
- Boards
- —
HDMI_Micro-D_Molex_46765-1xxx
Connector_Video
HDMI, Micro, Type D, THT, 0.4mm pitch, 19 ckt, right angle (http://www.molex.com/pdm_docs/sd/467651301_sd.pdf)
- Pads
- 20
- SMD
- 8.8×8.6
- Boards
- —
HDMI_Micro-D_Molex_46765-2xxx
Connector_Video
HDMI, Micro, Type D, THT/SMD hybrid, 0.4mm pitch, 19 ckt, right angle (http://www.molex.com/pdm_docs/sd/467651301_sd.pdf)
- Pads
- 20
- SMD
- 10.0×8.6
- Boards
- —
Crystal_SMD_MicroCrystal_CC1V-T1A-2Pin_8.0x3.7mm
Crystal
MicroCrystal CC1V-T1A, Crystal, 8.0x3.7mm package, SMD, http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC1V-T1A.pdf
- Pads
- 2
- SMD
- 9.1×4.7
- Boards
- —
Crystal_SMD_MicroCrystal_CC1V-T1A-2Pin_8.0x3.7mm_HandSoldering
Crystal
MicroCrystal CC1V-T1A, Crystal, 8.0x3.7mm package, SMD, hand-soldering, http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC1V-T1A.pdf
- Pads
- 2
- SMD
- 12.6×4.7
- Boards
- —
Crystal_SMD_MicroCrystal_CC4V-T1A-2Pin_5.0x1.9mm
Crystal
MicroCrystal CC4V-T1A, Crystal, 5.0x1.9mm package, SMD, http://cdn-reichelt.de/documents/datenblatt/B400/CC4V-T1A.pdf
- Pads
- 2
- SMD
- 6.0×2.9
- Boards
- —
Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf
- Pads
- 113
- SMD
- 9.0×9.0
- Boards
- —
Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 12
- SMD
- 4.5×4.0
- Boards
- —
Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 80
- SMD
- 6.0×6.0
- Boards
- —
UQFN-32_5x5mm_P0.5mm
Package_DFN_QFN
UQFN, 32 Pin (JEDEC MO-248 variation UHHD, 0.65mm maximum overall height, https://www.jedec.org/document_search?search_api_views_fulltext=MO-248)
- Pads
- 32
- SMD
- 6.2×6.2
- Boards
- —
Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm
Package_LGA
Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)
- Pads
- 11
- SMD
- 4.4×3.5
- Boards
- —
Microchip_PQFP-44_10x10mm_P0.8mm
Package_QFP
Microchip PQFP, 44 Pin (JEDEC MO-112 variation AA-2, Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20005418B.pdf#page=10, https://www.analog.com/media/en/technical-documentation/data-sheets/ad7722.pdf#page=23)
- Pads
- 44
- SMD
- 15.4×15.4
- Boards
- —
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- —
TQFP-80_14x14mm_P0.65mm
Package_QFP
TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)
- Pads
- 80
- SMD
- 17.3×17.3
- Boards
- —
Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm
Package_SON
Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —