Footprints
171 footprints matching “thermal”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm_ThermalVias
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 8
QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm_ThermalVias
Package_DFN_QFN
QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 8
TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm_ThermalVias
Package_QFP
TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 8
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 8
QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm_ThermalVias
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 7
WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias
Package_DFN_QFN
WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 7
WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)
- Pads
- 11
- SMD
- 3.8×3.0
- Boards
- 7
WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm_ThermalVias
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)
- Pads
- 11
- SMD
- 3.3×3.5
- Boards
- 7
QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 6
QFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 6
QFN-32-1EP_5x5mm_P0.5mm_EP3.7x3.7mm_ThermalVias
Package_DFN_QFN
QFN, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf)
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- 6
Texas_RHH0036C_VQFN-36-1EP_6x6mm_P0.5mm_EP4.4x4.4mm_ThermalVias
Package_DFN_QFN
Texas RHH0036C VQFN, 36 Pin (http://www.ti.com/lit/ds/slvsba5d/slvsba5d.pdf#page=37)
- Pads
- 37
- SMD
- 7.3×7.3
- Boards
- 6
LQFP-48-1EP_7x7mm_P0.5mm_EP3.6x3.6mm_ThermalVias
Package_QFP
LQFP, 48 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf)
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 6
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- 6
Infineon_PG-HSOF-8-1_ThermalVias
Package_TO_SOT_SMD
HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/)
- Pads
- 3
- SMD
- 13.8×10.6
- Boards
- 6
QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)
- Pads
- 29
- SMD
- 7.2×7.2
- Boards
- 5
QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm_ThermalVias
Package_DFN_QFN
QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)
- Pads
- 57
- SMD
- 8.2×8.2
- Boards
- 5
Texas_RSA_VQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
Texas RSA VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=44)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 5
VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm_ThermalVias
Package_DFN_QFN
VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 5
Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias
Package_LGA
Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)
- Pads
- 11
- SMD
- 4.4×3.5
- Boards
- 5
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 5
QFN-16-1EP_4x4mm_P0.65mm_EP2.15x2.15mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4001f.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 4
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 4