Footprints
6,095 footprints matching “mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
UQFN-28-1EP_4x4mm_P0.4mm_EP2.35x2.35mm_ThermalVias
Package_DFN_QFN
UQFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=338)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- —
UQFN-32_5x5mm_P0.5mm
Package_DFN_QFN
UQFN, 32 Pin (JEDEC MO-248 variation UHHD, 0.65mm maximum overall height, https://www.jedec.org/document_search?search_api_views_fulltext=MO-248)
- Pads
- 32
- SMD
- 6.2×6.2
- Boards
- —
UQFN-40-1EP_5x5mm_P0.4mm_EP3.8x3.8mm_ThermalVias
Package_DFN_QFN
UQFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=345)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- —
UQFN-48-1EP_6x6mm_P0.4mm_EP4.45x4.45mm_ThermalVias
Package_DFN_QFN
UQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- —
VQFN-12-1EP_4x4mm_P0.8mm_EP2.1x2.1mm
Package_DFN_QFN
VQFN, 12 Pin (https://www.mouser.ch/datasheet/2/268/EMC2301_2_3_5_Data_Sheet_DS20006532A-3443118.pdf)
- Pads
- 13
- SMD
- 5.2×5.2
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm
Package_DFN_QFN
VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm_ThermalVias
Package_DFN_QFN
VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm
Package_DFN_QFN
VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
VQFN-68-1EP_8x8mm_P0.4mm_EP4.3x4.3mm
Package_DFN_QFN
VQFN, 68 Pin (https://ftdichip.com/wp-content/uploads/2025/09/DS_FT2233HP.pdf#page=49)
- Pads
- 69
- SMD
- 9.2×9.2
- Boards
- —
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- —
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
DIP-10_W10.16mm
Package_DIP
10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 10
- THT
- 12.3×13.2
- Boards
- —
DIP-10_W7.62mm_SMDSocket_SmallPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 10
- SMD
- 10.7×13.3
- Boards
- —
DIP-10_W7.62mm_Socket_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 10
- THT
- 10.7×13.3
- Boards
- —
DIP-10_W8.89mm_SMDSocket_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 10
- SMD
- 12.5×13.3
- Boards
- —
DIP-18_W7.62mm_SMDSocket_SmallPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 18
- SMD
- 10.7×23.5
- Boards
- —
DIP-18_W8.89mm_SMDSocket_LongPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 18
- SMD
- 12.5×23.5
- Boards
- —
DIP-20_W7.62mm_SMDSocket_SmallPads
Package_DIP
20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 20
- SMD
- 10.7×26.0
- Boards
- —
DIP-22_W10.16mm_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 22
- THT
- 13.1×28.4
- Boards
- —
DIP-22_W10.16mm_SMDSocket_SmallPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads
- Pads
- 22
- SMD
- 13.2×28.6
- Boards
- —
DIP-22_W10.16mm_Socket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket, LongPads
- Pads
- 22
- THT
- 13.2×28.6
- Boards
- —
DIP-22_W11.43mm_SMDSocket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 11.43mm (450 mils), SMDSocket, LongPads
- Pads
- 22
- SMD
- 15.0×28.6
- Boards
- —