Footprints

711 footprints matching “50”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

711 footprints · page 24 of 30

Matched by name and keywords. Search by meaning instead

Stocko_MKS_1668-6-0-1818_1x18_P2.50mm_Vertical

FP3D

Connector_Stocko

Stocko MKS 16xx series connector, (https://www.stocko-contact.com/downloads/steckverbindersystem-raster-2,5-mm.pdf#page=15)

Pads
18
THT
50.7×8.5
Boards
—

Stocko_MKS_1670-6-0-2020_1x20_P2.50mm_Vertical

FP3D

Connector_Stocko

Stocko MKS 16xx series connector, (https://www.stocko-contact.com/downloads/steckverbindersystem-raster-2,5-mm.pdf#page=15)

Pads
20
THT
55.7×8.5
Boards
—

Crystal_HC50_Horizontal_1EP_style1

FP3D

Crystal

HC-50, Crystal, length 13.4mm, width 11.1mm, THT, http://www.crovencrystals.com/croven_pdf/HC-50_Crystal_Holder_Rev_00.pdf

Pads
3
THT
13.3×18.7
Boards
—

Crystal_HC50_Horizontal_1EP_style2

FP3D

Crystal

HC-50, Crystal, length 13.4mm, width 11.1mm, THT, http://www.crovencrystals.com/croven_pdf/HC-50_Crystal_Holder_Rev_00.pdf

Pads
3
THT
14.0×18.7
Boards
—

Crystal_SMD_SeikoEpson_MA506-4Pin_12.7x5.1mm

FP3D

Crystal

Seiko Epson MC-506, Crystal, 12.7x5.1mm package, SMD, http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf

Pads
4
SMD
15.7×6.1
Boards
—

Crystal_SMD_SeikoEpson_MA506-4Pin_12.7x5.1mm_HandSoldering

FP3D

Crystal

Seiko Epson MC-506, Crystal, 12.7x5.1mm package, SMD, hand-soldering, http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf

Pads
4
SMD
19.8×8.2
Boards
—

HDSP-7507

FP3D

Display_7Segment

+-1 overflow 7 segment high efficiency red, https://docs.broadcom.com/docs/AV02-2553EN

Pads
10
THT
8.1×13.2
Boards
—

Fuse_BelFuse_0ZRE0150FF_L23.4mm_W5.3mm

FP3D

Fuse

Fuse 0ZRE0150FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf

Pads
2
THT
23.9×5.8
Boards
—

Heatsink_AAVID_Extruded_531002B02500G_34.9x12.7mm_H25.4mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 25.4mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531102B02500G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531102V02500G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, AavSHIELD3 finish, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531202B00000G_34.9x12.7mm_H50.8mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, no pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
—
Mount
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531202B02100G_34.9x12.7mm_H50.8mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531202B02500G_34.9x12.7mm_H50.8mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531302B02500G_34.9x12.7mm_H63.5mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 63.5mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

L_2010_5025Metric

FP3D

Inductor_SMD

Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
6.4×3.2
Boards
—

L_APV_ANR5012

FP3D

Inductor_SMD

Inductor, APV, ANR5012, 5.0x5.0x1.2mm, (http://en.apvind.com/public/upload/20240407/3375c395e460caa8519b4d637d9113ce.pdf)

Pads
2
SMD
5.6×5.5
Boards
—

L_APV_ANR5020

FP3D

Inductor_SMD

Inductor, APV, ANR5020, 5.0x5.0x2.0mm, (http://en.apvind.com/public/upload/20240407/3375c395e460caa8519b4d637d9113ce.pdf)

Pads
2
SMD
5.6×5.5
Boards
—

L_APV_APH1050

FP3D

Inductor_SMD

Inductor, APV, APH1050, 10.8x10.0x4.8mm, (http://en.apvind.com/public/upload/20240408/996aafa961154ed753e4983e7eb80fa7.pdf)

Pads
2
SMD
14.1×10.5
Boards
—

L_APV_APH1250

FP3D

Inductor_SMD

Inductor, APV, APH1250, 13.25x12.8x4.8mm, (http://en.apvind.com/public/upload/20240408/996aafa961154ed753e4983e7eb80fa7.pdf)

Pads
2
SMD
15.2×13.3
Boards
—

L_Changjiang_FNR5015S

FP3D

Inductor_SMD

Inductor, Changjiang, FNR5015S, 5.0x5.0x1.5mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)

Pads
2
SMD
5.6×5.5
Boards
—

L_Changjiang_FNR8050S

FP3D

Inductor_SMD

Inductor, Changjiang, FNR8050S, 8.0x8.0x5.0mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)

Pads
2
SMD
8.7×8.5
Boards
—

L_Changjiang_FXL1350

FP3D

Inductor_SMD

Inductor, Changjiang, FXL1350, 12.9x12.6x4.8mm, (https://www.lcsc.com/datasheet/lcsc_datasheet_2404260921_cjiang--Changjiang-Microelectronics-Tech-FXL0420-2R2-M_C167206.pdf)

Pads
2
SMD
15.0×13.1
Boards
—

L_Chilisin_BMRB00050512

FP3D

Inductor_SMD

Inductor, Chilisin, BMRB00050512, 5.7x5.4x1.2mm, (https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf)

Pads
2
SMD
6.5×5.9
Boards
—