Footprints
1,486 footprints matching “5mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-44-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias
Package_DFN_QFN
QFN, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 2
QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm
Package_DFN_QFN
QFN, 56 Pin (http://www.ti.com/lit/an/scea032/scea032.pdf#page=4)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- 2
QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm
Package_DFN_QFN
QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)
- Pads
- 65
- SMD
- 9.2×9.2
- Boards
- 2
QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm
Package_DFN_QFN
64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- 2
Texas_RGP0020H_VQFN-20-1EP_4x4mm_P0.5mm_EP2.4x2.4mm
Package_DFN_QFN
Texas RGP0020H VQFN, 20 Pin (http://www.ti.com/lit/ds/symlink/cc1101.pdf#page=101)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- 2
UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm
Package_DFN_QFN
16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 2
UQFN-40-1EP_5x5mm_P0.4mm_EP3.8x3.8mm
Package_DFN_QFN
UQFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=345)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 2
WDFN-8-1EP_6x5mm_P1.27mm_EP3.4x4mm
Package_DFN_QFN
WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf)
- Pads
- 9
- SMD
- 7.2×5.5
- Boards
- 2
VLGA-4_2x2.5mm_P1.65mm
Package_LGA
VLGA, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf#page=15)
- Pads
- 4
- SMD
- 2.5×3.0
- Boards
- 2
PQFP-208_28x28mm_P0.5mm
Package_QFP
PQFP, 208 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)
- Pads
- 208
- SMD
- 31.9×31.9
- Boards
- 2
PQFP-240_32.1x32.1mm_P0.5mm
Package_QFP
PQFP, 240 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)
- Pads
- 240
- SMD
- 35.9×35.9
- Boards
- 2
TQFP-100-1EP_14x14mm_P0.5mm_EP5x5mm_ThermalVias
Package_QFP
TQFP, 100 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_100_4.pdf)
- Pads
- 101
- SMD
- 17.3×17.3
- Boards
- 2
TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm
Package_QFP
TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 2
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 2
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 2
MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm
Package_SO
MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)
- Pads
- 17
- SMD
- 6.3×4.5
- Boards
- 2
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 2
SSOP-44_5.3x12.8mm_P0.5mm
Package_SO
44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf)
- Pads
- 44
- SMD
- 8.5×13.3
- Boards
- 2
Texas_PWP0020A
Package_SO
20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)
- Pads
- 21
- SMD
- 8.2×7.0
- Boards
- 2
TSSOP-20_4.4x5mm_P0.5mm
Package_SO
TSSOP, 20 Pin (JEDEC MO-153 Var BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 20
- SMD
- 7.7×5.5
- Boards
- 2
TSSOP-24_4.4x5mm_P0.4mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×5.5
- Boards
- 2
TSSOP-28_6.1x9.7mm_P0.65mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 9.4×10.2
- Boards
- 2
TSSOP-44_4.4x11.2mm_P0.5mm
Package_SO
TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)
- Pads
- 44
- SMD
- 7.4×11.9
- Boards
- 2