Footprints
135 footprints matching “0.65mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_RSA_VQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm
Package_DFN_QFN
Texas RSA VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=44)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 5
Texas_RSA_VQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
Texas RSA VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=44)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 5
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 5
QFN-16-1EP_4x4mm_P0.65mm_EP2.15x2.15mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4001f.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 4
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 4
QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276)
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- 4
TSSOP-14-1EP_4.4x5mm_P0.65mm
Package_SO
14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)
- Pads
- 15
- SMD
- 7.9×5.6
- Boards
- 4
QFN-24-1EP_5x5mm_P0.65mm_EP3.2x3.2mm
Package_DFN_QFN
QFN, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/(UH24)%20QFN%2005-08-1747%20Rev%20A.pdf)
- Pads
- 25
- SMD
- 6.3×6.3
- Boards
- 3
Texas_RGW0020A_VQFN-20-1EP_5x5mm_P0.65mm_EP3.15x3.15mm
Package_DFN_QFN
Texas RGW0020A VQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps7a47.pdf#page=29)
- Pads
- 21
- SMD
- 6.3×6.3
- Boards
- 3
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
Package_SO
MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 3
SSOP-18_4.4x6.5mm_P0.65mm
Package_SO
SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)
- Pads
- 18
- SMD
- 6.9×7.0
- Boards
- 3
Texas_S-PVSON-N8
Package_SON
8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf
- Pads
- 9
- SMD
- 4.2×3.6
- Boards
- 3
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.35x2.35mm_ThermalVias
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_20.pdf, CP-16-20)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 2
LFCSP-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_CSP
LFCSP, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-6/cp_6_3.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 2
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 2
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 2
Texas_PWP0020A
Package_SO
20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)
- Pads
- 21
- SMD
- 8.2×7.0
- Boards
- 2