Footprints

1,801 footprints matching “SO”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

1,801 footprints · page 3 of 76

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TSOT-23-6

FP3D

Package_TO_SOT_SMD

TSOT, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AA)

Pads: 6
SMD: 4.1×3.4
Boards: 352

SOT-323_SC-70

FP3D

Package_TO_SOT_SMD

SOT, 3 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf#page=148)

Pads: 3
SMD: 2.9×2.2
Boards: 350

MSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)

Pads: 8
SMD: 6.4×3.5
Boards: 348

MSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)

Pads: 10
SMD: 6.2×3.5
Boards: 333

PinSocket_1x10_P2.54mm_Vertical

FP3D

Connector_PinSocket_2.54mm

Through hole straight socket strip, 1x10, 2.54mm pitch, single row (from Kicad 4.0.7), script generated

Pads: 10
THT: 3.5×26.4
Boards: 329

DIP-8_W7.62mm_Socket

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×10.8
Boards: 322

SOT-23-6_Handsoldering

FP3D

Package_TO_SOT_SMD

6-pin SOT-23 package, Handsoldering

Pads: 6
SMD: 4.8×3.6
Boards: 316

SOT-143

FP3D

Package_TO_SOT_SMD

SOT-143 https://www.nxp.com/docs/en/package-information/SOT143B.pdf

Pads: 4
SMD: 3.2×3.4
Boards: 308

L_0603_1608Metric_Pad1.05x0.95mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 3.3×1.5
Boards: 295

SOIC-16W_7.5x10.3mm_P1.27mm

FP3D

Package_SO

SOIC, 16 Pin (JEDEC MS-013AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/rw_16.pdf)

Pads: 16
SMD: 11.9×10.8
Boards: 282

SOIC-20W_7.5x12.8mm_P1.27mm

FP3D

Package_SO

SOIC, 20 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf)

Pads: 20
SMD: 11.9×13.3
Boards: 279

Fuse_1206_3216Metric_Pad1.42x1.75mm_HandSolder

FP3D

Fuse

Fuse SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 4.9×2.3
Boards: 275

D_SMA_Handsoldering

FP3D

Diode_SMD

Diode SMA (DO-214AC) Handsoldering

Pads: 2
SMD: 9.0×3.5
Boards: 273

TSOT-23-5

FP3D

Package_TO_SOT_SMD

TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB)

Pads: 5
SMD: 4.1×3.4
Boards: 256

SSOP-28_5.3x10.2mm_P0.65mm

FP3D

Package_SO

SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)

Pads: 28
SMD: 9.4×10.7
Boards: 244

TSSOP-24_4.4x7.8mm_P0.65mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 24
SMD: 7.7×8.3
Boards: 242

C_1210_3225Metric_Pad1.33x2.70mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)

Pads: 2
SMD: 5.0×3.2
Boards: 241

D_DO-41_SOD81_P7.62mm_Horizontal

FP3D

Diode_THT

Diode, DO-41_SOD81 series, Axial, Horizontal, pin pitch=7.62mm, length*diameter=5.2*2.7mm^2, https://www.diodes.com/assets/Package-Files/DO-41-Plastic.pdf

Pads: 2
THT: 10.3×3.2
Boards: 227