Footprints
675 footprints matching “lead”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TO-92_Wide
Package_TO_SOT_THT
TO-92 leads molded, wide, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 7.1×5.6
- Boards
- 66
DIP-24_W15.24mm_Socket
Package_DIP
24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket
- Pads
- 24
- THT
- 18.3×31.1
- Boards
- 63
LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y
Package_LGA
LGA, 16 Pin (https://www.st.com/resource/en/datasheet/lis331dlh.pdf)
- Pads
- 16
- SMD
- 3.5×3.5
- Boards
- 61
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 60
DIP-28_W15.24mm_Socket_LongPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads
- Pads
- 28
- THT
- 18.3×36.2
- Boards
- 59
DIP-24_W7.62mm
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 24
- THT
- 9.7×31.0
- Boards
- 57
SMDIP-4_W9.53mm
Package_DIP
4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 4
- SMD
- 12.0×5.6
- Boards
- 57
DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 55
TSOP-II-54_22.2x10.16mm_P0.8mm
Package_SO
54-lead TSOP typ II package
- Pads
- 54
- SMD
- 13.5×22.7
- Boards
- 55
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
TO-92L_Inline
Package_TO_SOT_THT
TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)
- Pads
- 3
- THT
- 5.5×4.6
- Boards
- 51
SW_Push_1P1T_NO_CK_KSC6xxJ
Button_Switch_SMD
Tactile switch, 6.2x6.25 mm, H7.68 mm, J leads, https://www.ckswitches.com/media/1972/ksc6.pdf
- Pads
- 2
- SMD
- 9.1×6.8
- Boards
- 50
LGA-14_3x5mm_P0.8mm_LayoutBorder1x6y
Package_LGA
LGA, 14 Pin (http://www.st.com/resource/en/datasheet/lsm303dlhc.pdf)
- Pads
- 14
- SMD
- 3.5×5.5
- Boards
- 50
SO-4_4.4x3.6mm_P2.54mm
Package_SO
4-Lead Plastic Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339
- Pads
- 4
- SMD
- 8.8×4.1
- Boards
- 49
DIP-28_W7.62mm_Socket_LongPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 28
- THT
- 10.7×36.2
- Boards
- 48
DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm
Package_DFN_QFN
DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 47
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
DIP-40_W15.24mm_LongPads
Package_DIP
40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 40
- THT
- 18.1×51.3
- Boards
- 45
QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
Package_DFN_QFN
QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 44
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 41
QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm
Package_DFN_QFN
QFN, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf)
- Pads
- 37
- SMD
- 7.2×7.2
- Boards
- 40
DIP-18_W7.62mm_Socket
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 18
- THT
- 10.7×23.5
- Boards
- 39
Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm
Package_SON
Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 39
Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering
Package_LGA
Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44)
- Pads
- 8
- SMD
- 3.5×3.5
- Boards
- 38