Footprints
90 footprints matching “0.5A”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Mounting_Wuerth_WA-SMSI-M2.5_H0.5mm_9774005151
Mounting_Wuerth
Mounting Hardware, inside through hole M2.5, height 0.5, Wuerth electronics 9774005151 (https://www.we-online.com/components/products/datasheet/9774005151R.pdf)
- Pads
- 1
- SMD
- 6.5×6.5
- Boards
- —
Mounting_Wuerth_WA-SMSI-M3_H0.5mm_9774005360
Mounting_Wuerth
Mounting Hardware, inside through hole M3, height 0.5, Wuerth electronics 9774005360 (https://www.we-online.com/components/products/datasheet/9774005360R.pdf)
- Pads
- 1
- SMD
- 7.9×7.9
- Boards
- —
FPC_1x22_P0.5mm
muratovas-MAS_Package_nostd
Molex FFC/FPC connector, 50 bottom-side contacts, 0.5mm pitch
- Pads
- 22
- SMD
- 11.5×3.6
- Boards
- —
FPC_1x30_P0.5mm
muratovas-MAS_Package_nostd
Molex FFC/FPC connector, 30 bottom-side contacts, 0.5mm pitch
- Pads
- 30
- SMD
- 15.5×3.6
- Boards
- —
csBGA-64_5x5mm_Layout8x8_P0.5mm
Package_BGA
csBGA-64, 5x5mm, 64 Ball, 8x8 Layout, 0.5mm Pitch, https://www.latticesemi.com/view_document?document_id=213
- Pads
- 64
- SMD
- 7.0×7.0
- Boards
- —
NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm
Package_BGA
NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf
- Pads
- 98
- SMD
- 9.0×9.0
- Boards
- —
Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf
- Pads
- 10
- SMD
- 3.4×3.9
- Boards
- —
Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf
- Pads
- 12
- SMD
- 4.1×3.6
- Boards
- —
Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf
- Pads
- 113
- SMD
- 9.0×9.0
- Boards
- —
TFBGA-64_5x5mm_Layout8x8_P0.5mm
Package_BGA
TFBGA-64, 5.0x5.0mm, 64 Ball, 8x8 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f100v8.pdf#page=83
- Pads
- 64
- SMD
- 7.0×7.0
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
DFN-16-1EP_3x5mm_P0.5mm_EP1.66x4.4mm
Package_DFN_QFN
DHC Package; 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf)
- Pads
- 17
- SMD
- 4.0×5.6
- Boards
- —
DFN-16-1EP_5x5mm_P0.5mm_EP3.46x4mm
Package_DFN_QFN
DH Package; 16-Lead Plastic DFN (5mm x 5mm) (see Linear Technology DFN_16_05-08-1709.pdf)
- Pads
- 17
- SMD
- 6.0×5.6
- Boards
- —
DFN-18-1EP_3x5mm_P0.5mm_EP1.66x4.4mm
Package_DFN_QFN
DHC Package; 18-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf)
- Pads
- 19
- SMD
- 4.0×5.6
- Boards
- —
DFN-18-1EP_4x5mm_P0.5mm_EP2.44x4.34mm
Package_DFN_QFN
DHD Package; 18-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_18_05-08-1778.pdf)
- Pads
- 19
- SMD
- 5.0×5.6
- Boards
- —
DFN-20-1EP_5x6mm_P0.5mm_EP3.24x4.24mm
Package_DFN_QFN
DFN20, 6x5, 0.5P; CASE 505AB (see ON Semiconductor 505AB.PDF)
- Pads
- 21
- SMD
- 5.8×6.7
- Boards
- —
DFN-22-1EP_5x6mm_P0.5mm_EP3.14x4.3mm
Package_DFN_QFN
DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF-01 (https://www.onsemi.com/download/package-drawing/pdf/506af.pdf)
- Pads
- 23
- SMD
- 6.3×6.7
- Boards
- —
DFN-24-1EP_4x7mm_P0.5mm_EP2.64x6.44mm
Package_DFN_QFN
DKD Package; 24-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_24_05-08-1864.pdf)
- Pads
- 25
- SMD
- 5.0×7.6
- Boards
- —